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Many computational studies on hotspot microfluidic cooling devices found in the literature rely on simplified assumptions and conventions that do not capture the full complexity of the conjugate thermal problem, such as constant…
A model of a multilayer device with non-trivial geometrical structure and nonlinear dependencies of thermodynamic material properties at cryogenic temperatures is suggested. A considered device, called cryogenic cell, is intended for use in…
Virtual Data Center (VDC) embedding has drawn significant attention recently because of growing need for efficient and flexible means of Data Center (DC) resource allocation. Existing studies on VDC embedding mainly focus on improving DCs'…
The design of microfluidic devices is a cumbersome and tedious process that can be significantly improved by simulation. Methods based on Computational Fluid Dynamics (CFD) are considered state-of-the-art, but require extensive compute time…
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…
Thermal analysis is crucial in 3D-IC design due to increased power density and complex heat dissipation paths. Although operator learning frameworks such as DeepOHeat~\cite{liu2023deepoheat} have demonstrated promising preliminary results…
It is known that 3D-ICs suffer from hot spot temperatures that can reach thousands of degrees, if they are not cooled to reasonable operating temperatures. The problem of hot spots is not limited to the high temperatures of the IC; thermal…
The modeling and analysis of superconducting coils is an essential task in the design stage of most devices based on high-temperature superconductors (HTS). These calculations allow verifying basic estimations and assumptions, proposing…
Monolithic 3D (M3D) technology enables high density integration, performance, and energy-efficiency by sequentially stacking tiers on top of each other. M3D-based network-on-chip (NoC) architectures can exploit these benefits by adopting…
Predicting three-dimensional thermal loads during tokamak disruptions is essential for ITER yet remains weakly developed. We present a physics-based workflow that couples MHD simulations of vertical displacement events with field line…
The consistent demand for better performance has lead to innovations at hardware and microarchitectural levels. 3D stacking of memory and logic dies delivers an order of magnitude improvement in available memory bandwidth. The price paid…
The continuous increase in computational power of GPUs, essential for advancements in areas like artificial intelligence and data processing, is driving the adoption of liquid cooling in data centers. Skived copper cold plates featuring…
Functional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems. Therefore, information from different physical domains has to be…
As mechanical systems become more complex and technological advances accelerate, the traditional reliance on heritage designs for engineering endeavors is being diminished in its effectiveness. Considering the dynamic nature of the design…
The success of large language models LLMs amplifies the need for highthroughput energyefficient inference at scale. 3DDRAMbased accelerators provide high memory bandwidth and therefore an opportunity to accelerate the bandwidthbound decode…
The French collaborative Trio4CLF project aims to understand and control the cryogenic cooling of amplifiers for high power (~1 PetaWatt) and high repetition rate (1-10 Hertz) lasers. In such amplifiers, the fluid (low temperature gaseous…
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…
The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase…
Artificially designed composite materials consist of microstructures, that exhibit various thermal properties depending on their shapes, such as anisotropic thermal conductivity. One of the representative applications of such composite…
Thermal management is a major challenge in next-generation high-performance computing systems, particularly for heterogeneous multi-chip packages such as the NVIDIA GB200 Grace Blackwell Superchip. In this work, a physics-based…