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The complexity of droplet microfluidics grows by implementing parallel processes and multiple functionalities on a single device. This poses a challenge to the engineer designing the microfluidic networks. In today's design processes, the…
The reported research work presents numerical studies validated by experimental results of a flat micro heat pipe with sintered copper wick structure. The objectives of this project are to produce and demonstrate the efficiency of the…
Recent embedded systems are designed with high-performance System-on-Chips (SoCs) to satisfy the computational needs of complex applications widely used in real life, such as airplane controllers, autonomous driving automobiles, medical…
Hydrogen fuel cells are a key technology in the transition toward carbon-neutral energy systems, offering clean power with water as the only byproduct. Microfluidic fuel cells, which operate at the microliter scale, are an emerging variant…
The autoregressive decoding in LLMs is the major inference bottleneck due to the memory-intensive operations and limited hardware bandwidth. 3D-stacked architecture is a promising solution with significantly improved memory bandwidth, which…
The designers pre-occupation to reduce energy consumption and to achieve better thermal ambience levels, has favoured the setting up of numerous building thermal dynamic simulation programs. The progress in the modelling of phenomenas and…
Although 3D IC technology can provide very high integration density, they suffer from having hotspots that may reach thousands of degrees. To manage this heat, it is necessary to study the dynamics of cooling and thermal behavior of the…
While parallel microchannel based cooling systems have been around for quite a period of time, employing the same and incorporating them for near active cooling of microelectronic devices is yet to be implemented and the implications of the…
By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…
The designer's preoccupation to reduce the energy needs and get a better thermal quality of ambiances helped in the development of several packages simulating the dynamic behaviour of buildings. This paper shows the adaptation of a method…
Hot-spots are considered among the unavoidable consequences of the high integration density of 3D-ICs. Eliminating hot spots requires employing efficient cooling techniques. Using embedded channels, liquid cooling systems can be designed to…
Modern package designs make use of technologies such as backside power delivery (BSPD) and 3D stacked chiplets that require accounting for the heterogeneity in back end of the line (BEOL) structures in hot-spot prediction. Multiscale…
Multi-stage cascade architecture exists widely in many industrial systems such as recommender systems and online advertising, which often consists of sequential modules including matching, pre-ranking, ranking, etc. For a long time, it is…
This report details the design and optimisation of a water-cooled forced convection heat dissipation system for use in high-temperature applications (ranges between 700 degrees - 1000 degrees K). A hollow cuboid vapour chamber model was…
Thermal Desktop (TD) is an industry-standard thermal analysis tool used to create and analyze thermal models for landers, rovers, spacecraft, and instrument payloads. Currently, limited software exists to extract and visualize metrics…
Liquid jet impingement cooling is an efficient cooling technique where the liquid coolant is directly ejected from nozzles on the chip backside resulting in a high cooling efficiency due to the absence of the TIM and the lateral temperature…
The thermal conductivity of Functionally Graded Materials (FGMs) can be efficiently designed through topology optimization to obtain thermal meta-structures that actively steer the heat flow. Compared to conventional analytical design…