Related papers: Through-chip microchannels for three-dimensional i…
Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enables more opportunities to architect 3DICs with different die…
We observe and comprehend the dynamical Coulomb blockade suppression of the electrical conductance across an electronic quantum channel submitted to a temperature difference. A broadly tunable, spin-polarized Ga(Al)As quantum channel is…
We investigate evolution of the intracluster medium (ICM), considering the relaxation process between the ions and electrons. According to the standard scenario of structure formation, ICM is heated by the shock in the accretion flow to the…
The paper presents the comparative study of the vortex-induced cooling of a heated channel for the four different cross-sections of the rigid cylinder, i.e., circular, square, semi-circular, and triangular, with or without the…
This study explores heat transfer mechanisms in heat pipes with sub-critical nanopores using coarse-grained molecular dynamics (CGMD) simulations, aiming to enhance thermal management in nanoscale applications. With the increasing need for…
Optomechanical systems provide a versatile platform for precision measurements and investigations of fundamental physics, where bringing macroscopic resonators into the quantum regime is a widely pursued goal. Achieving such quantum…
The design and operation of an electronic cooler based on a combination of superconducting tunnel junctions is described. The cascade extraction of hot-quasiparticles, which stems from the energy gaps of two different superconductors,…
Steep gradients of temperature and density, called cold fronts, are observed by Chandra in a leading edge of subclusters moving through the intracluster medium (ICM). The presence of cold fronts indicates that thermal conduction across the…
This paper explores the potential of cryogenic semiconductor computing and superconductor electronics as promising alternatives to traditional semiconductor devices. As semiconductor devices face challenges such as increased leakage…
3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal…
The thermal conductivity of water features a maximum (TCM) as a function of temperature at constant pressure. By examining why molecular force fields succeed or fail to reproduce the maximum and interpreting our results using the Bridgman…
On-chip thermometry at deep-cryogenic temperatures is vital in quantum computing applications to accurately quantify the effect of increased temperature on qubit performance. In this work, we present a sub-1 K temperature sensor in CMOS…
As experimental quantum information processing (QIP) rapidly advances, an emerging challenge is to design a scalable architecture that combines various quantum elements into a complex device without compromising their performance. In…
Microchannel heat sinks (MCHS) are widely used for thermal management in high-power electronics due to their ability to dissipate large heat fluxes with minimal coolant consumption. While numerous strategies - such as geometric…
We propose a solid state refrigeration technique based on repeated adiabatic magnetization/demagnetization cycles of a superconductor which acts as the working substance. The gradual cooling down of a substrate (normal metal) in contact…
The performance of hybrid superconducting electronic coolers is usually limited by the accumulation of hot quasi-particles in the superconducting leads. This issue is all the more stringent in large-scale and high-power devices, as required…
In-memory computing (IMC) is an emerging non-von Neumann paradigm that leverages the intrinsic physics of memory devices to perform computations directly within the memory array. Among the various candidates, phase-change memory (PCM) has…
Thermal management of integrated circuits (ICs) is important to prevent thermal hotspots which are the leading cause of IC failure. Thermal management is even more critical in 3D integrated circuits (3D ICs) as the prevalence of thermal…
This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient…
Heat generation from electronics increases with the advent of high-density integrated circuit technology. To come up with the heat generation, microscale cooling has been thought as a promising technology. Prediction of heat transfer rate…