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On-chip demagnetization refrigeration has recently emerged as a powerful tool for reaching microkelvin electron temperatures in nanoscale structures. The relative importance of cooling on-chip and off-chip components and the thermal…
Micro-refrigerators that operate in the sub-kelvin regime are a key device in quantum technology. A well-studied candidate, an electronic cooler using Normal metal - Insulator - Superconductor (NIS) tunnel junctions offers substantial…
Cellular metabolic rate is a good indicator of the physiological state of cells and its changes, which can be measured by total heat flux accompanying metabolism. Chip calorimeters can provide label-free and high throughput measurements of…
Semiconductor integrated circuits operated at cryogenic temperature will play an essential role in quantum computing architectures. These can offer equivalent or superior performance to their room-temperature counterparts while enabling a…
We report the results of a computer simulation study of the thermodynamic properties and the thermal conductivity of supercooled water as a function of pressure and temperature using the TIP4P-2005 water model. The thermodynamic properties…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
Heat capacity measurements under high pressure places high demands on the calorimeter. Here we describe the development of a miniaturized nanocalorimeter for high-pressure heat capacity measurements at low temperature. The device,…
3D stacked technology has emerged as an effective mechanism to overcome physical limits and communication delays found in 2D integration. However, 3D technology also presents several drawbacks that prevent its smooth application. Two of the…
Heat management and refrigeration are key concepts for nanoscale devices operating at cryogenic temperatures. The design of an on-chip mesoscopic refrigerator that works thanks to the input heat is presented, thus realizing a solid state…
Inherent properties of superconducting Bi2Sr2CaCu2O8+x films, such as the high superconducting transition temperature Tc, efficient Josephson coupling between neighboring CuO layers, and fast quasiparticle relaxation dynamics, make them a…
Cooling nanoelectronic devices below 10 mK is a great challenge since thermal conductivities become very small, thus creating a pronounced sensitivity to heat leaks. Here, we overcome these difficulties by using adiabatic demagnetization of…
Cryogenic microsystems that utilize different 3D integration techniques are being actively developed, e.g., for the needs of quantum technologies. 3D integration can introduce opportunities and challenges to the thermal management of low…
Water confined to channels one nanometer thick exhibits electrochemical behavior distinct from bulk water, including enhanced protonic conductivity and large dielectric anisotropy. Here, we exploit these characteristics to design a scalable…
Water can be transitioned to an enhanced heat-conducting phase by supercooling only the water at the bottom of a container. The temperature gradient across the 4 cm in the center of an 8 cm long column of water with a 397 mW heat source at…
Silicon photonic devices fundamental to high-density wavelength-division multiplexed (DWDM) optical links and photonic switching networks, such as resonant modulators and Mach-Zehnder interferometers (MZIs), are highly sensitive to…
Fabricating 3D printed electronics using desktop printers has become more accessible with recent developments in conductive thermoplastic filaments. Because of their high resistance and difficulties in printing traces in vertical…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
Microfabricated ion-trap devices offer a promising pathway towards scalable quantum computing. Research efforts have begun to focus on the engineering challenges associated with developing large-scale ion-trap arrays and networks. However,…
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with…
Liquid jet impingement cooling is an efficient cooling technique where the liquid coolant is directly ejected from nozzles on the chip backside resulting in a high cooling efficiency due to the absence of the TIM and the lateral temperature…