Related papers: EUV Debris Mitigation using Magnetic Nulls
The new EUV Lithography tools for IC High Volume Manufacture at 22nm make use of EUV radiation at \lambda = 13.5nm. High power Laser (LPP) and Discharge (DPP)EUV light sources are based on Sn plasmas for the optimum conversion of electrical…
The next generation of lithography machines uses extreme ultraviolet (EUV) light originating from laser-produced plasma (LPP) sources, where a small tin droplet is ionized by an intense laser pulse to emit the requested light at 13.5 nm.…
In the past years, EUV lithography scanner systems have entered High-Volume Manufacturing for state-of-the-art Integrated Circuits (IC), with critical dimensions down to 10 nm. This technology uses 13.5 nm EUV radiation, which is shaped and…
Extreme ultraviolet (EUV) lithography is the leading lithography technique in CMOS mass production, moving towards the sub-10 nm half-pitch (HP) regime with the ongoing development of the next generation high-numerical aperture (high-NA)…
The new generation of lithography tools use high energy EUV radiation which ionizes the present background gas due to photoionization. To predict and understand the long term impact on the highly delicate mirrors It is essential to…
EUV Lithography is the technology of choice for High-Volume Manufacturing (HVM) of sub-10nm lithography. One of the challenges is to enable in-situ cleaning of functional surfaces such as sensors, fiducials and interferometer mirrors…
A critical technology for high-volume manufacturing of nanoscale integrated circuits is a high-power extreme ultraviolet (EUV) light source. Over the past decades, laser-produced plasma (LPP) sources have been actively utilized in this…
An experimental setup that directly reproduces Extreme UV-lithography relevant conditions for detailed component exposure tests is described. The EUV setup includes a pulsed plasma radiation source, operating at 13.5 nm; a debris mitigation…
Extreme ultraviolet (EUV) lithography is the cornerstone of the fabrication of advanced integrated circuits at the 7-nm node and beyond, but its reliance on multi-element reflective projection optics makes it inaccessible for small-scale…
A new approach for an in-line beam monitor for ionizing radiation was introduced in a recent publication (Beckers, J., et al. "Mapping electron dynamics in highly transient EUV photon-induced plasmas: a novel diagnostic approach using…
The study presented here was initiated by a discussion to investigate the possibility of using synchrotron radiation as a source for the Next Generation Lithography (NGL) based on the EUV-concept (Extreme Ultra-Violet; here 13.5 nm or 11.3…
In this work, we show the feasibility of extreme ultraviolet (EUV) patterning on an HF-treated Si(100) surface in the absence of a photoresist. EUV lithography is the leading lithography technique in semiconductor manufacturing due to its…
Microscopy with extreme ultraviolet (EUV) radiation holds promise for high-resolution imaging with excellent material contrast, due to the short wavelength and numerous element-specific absorption edges available in this spectral range. At…
We discuss a concept of a point-like source of the extreme ultraviolet (EUV) light based on a non-equilibrium microwave discharge in expanding jet of dense xenon plasma with multiply charged ions. A conversion efficiency of microwave…
This paper discusses a simple, low-cost, highly efficient two-mirror projector with a simplified illumination system. The EUV source power can be reduced by 1/10 compared to the current six-mirror EUV projector system. The required EUV…
In the past years, EUV lithography scanner systems have entered High-Volume Manufacturing for state-of-the-art Integrated Circuits (IC), with critical dimensions down to 10 nm. This technology uses 13.5 nm EUV radiation, which is…
The absence of efficient light modulators for extreme ultraviolet (EUV) and X-ray photons significantly limits their real-life application, particularly when even slight complexity of the beam patterns is required. Here we report on a novel…
At optical frequencies, interactions of the electric field component of light with matter are dominating, whereas magnetic dipole transitions are inherently weak and challenging to access independently from electric dipole transitions.…
We present a comprehensive characterization of laser-produced tin (Sn) plasmas relevant to extreme ultraviolet (EUV) lithography using a multi-diagnostic suite integrated into the new experimental platform, "SparkLight". Tin plasmas are…
Improvement of tool reliability and uptime is a current focus in development of extreme ultraviolet lithography. The lifetime of collection mirrors for extreme ultraviolet light in tin-based plasma light sources is limited considerably by…