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Molecular communication via diffusion (MCvD) is considered as one of the most feasible communication paradigms for nanonetworks, especially for bio-nanonetworks which are usually in water-rich biological environments. Two effects that…
The main advantage of Microwave Kinetic Inductance Detector arrays (MKID) is their multiplexing capability, which allows for building cameras with a large number of pixels and good sensitivity, particularly suitable to perform large blank…
We present a real-time visual-inertial dense mapping method capable of performing incremental 3D mesh reconstruction with high quality using only sequential monocular images and inertial measurement unit (IMU) readings. 6-DoF camera poses…
The 2D/3D construction of hybrid perovskite interfaces is gaining increasing attention due to their enhanced stability towards degradation without compromising the corresponding solar cell efficiency. Much of it is due to the interfacial…
We present a metric embedding that captures spatiotemporal patterns of cell signaling dynamics in 5-D $(x,y,z,channel,time)$ live cell microscopy movies. The embedding uses a metric distance called the normalized information distance (NID)…
The performance of holographic multiple-input multiple-output (MIMO) communications, employing two-dimensional (2-D) planar antenna arrays, is typically compromised by finite degrees-of-freedom (DOF) stemming from limited array size. The…
We describe a modified SIMD architecture suitable for single-chip integration of a large number of processing elements, such as 1,000 or more. Important differences from traditional SIMD designs are: a) The size of the memory per processing…
The silicon/silicon dioxide (Si/SiO2) interface plays a crucial role in the performance, cost, and reliability of most modern microelectronic devices, from the basic transistor to flash memory, digital cameras, and solar cells. Today the…
Millimeter wave (mmWave) MIMO will likely use hybrid analog and digital precoding, which uses a small number of RF chains to avoid energy consumption associated with mixed signal components like analog-to-digital components not to mention…
Photonic computing shows promise for transformative advancements in machine learning (ML) acceleration, offering ultra-fast speed, massive parallelism, and high energy efficiency. However, current photonic tensor core (PTC) designs based on…
Photonic integration on plastic substrates enables emerging applications ranging from flexible interconnects to conformal sensors on biological tissues. Such devices are traditionally fabricated using pattern transfer, which is complicated…
Microfluidic mixing is a fundamental functionality in most lab on a chip (LOC) systems,whereas realization of efficient mixing is challenging in microfluidic channels due to the small Reynolds numbers. Here, we design and fabricate a…
With the rapid growth of deep neural networks (DNNs), compute-in-memory (CIM) has emerged as a promising energy-efficient paradigm for accelerating multiply-and-accumulate (MAC) operations. Yet, current CIM architectures are largely limited…
Multiplexed operations and extended coherent control over multiple trapping sites are fundamental requirements for a trapped-ion processor in a large scale architecture. Here we demonstrate these building blocks using a surface-electrode…
Large-scale arrays of Microwave Kinetic Inductance Detectors (MKIDs) are attractive candidates for use in imaging instruments for next generation submillimeter-wave telescopes such as CCAT. We have designed and fabricated tightly packed…
Layer transfer offers enormous potential for the industrial implementation of 2D material technology platforms. However, the transfer method used must retain as-grown uniformity and cleanliness in the transferred films for the fabrication…
This paper presents a memory efficient, high throughput parallel lifting based running three dimensional discrete wavelet transform (3-D DWT) architecture. 3-D DWT is constructed by combining the two spatial and four temporal processors.…
The increasing computational demands of deep learning models pose significant challenges for edge devices. To address this, we propose a memristor-based circuit design for MobileNetV3, specifically for image classification tasks. Our design…
Pristine van der Waals (vdW) interfaces between two-dimensional (2D) and other materials are core to emerging optical and electronic devices. Their direct fabrication is, however, challenged as the vdW forces are weak and cannot be tuned to…
We report the use of plasma-enhanced atomic layer deposition (PEALD) to fabricate single-electron transistors (SETs) featuring ultra-thin (~1 nm) tunnel-transparent SiO2 in Ni-SiO2-Ni tunnel junctions. We show that as a result of the O2…