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To improve transistor density and electronic performance, next-generation semiconductor devices are adopting three-dimensional architectures and feature sizes down to the few-nm regime, which require atomic-scale metrology to identify and…
This paper presents an innovative approach to 3D mixed-size placement in heterogeneous face-to-face (F2F) bonded 3D ICs. We propose an analytical framework that utilizes a dedicated density model and a bistratal wirelength model,…
Quasi-one-dimensional (Q1D) systems, i.e., three- and two-dimensional (3D/2D) arrays composed of weakly coupled one-dimensional lattices of interacting quantum particles, exhibit rich and fascinating physics. They are studied across various…
Increase in image resolution require the ability of image sensors to pack an increased number of circuit components in a given area. On the the other hand a high speed processing of signals from the sensors require the ability of pixel to…
The Ion Beam Induced Charge (IBIC) technique is widely used to characterize the electronic properties of semiconductor materials and devices. Its main advantage over other charge collection microscopies stems in the use of MeV ion probes,…
Diodes made of heterostructures of the 2D material graphene and conventional 3D materials are reviewed in this manuscript. Several applications in high frequency electronics and optoelectronics are highlighted. In particular, advantages of…
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and…
Traditional photonic integrated circuit (PIC) inherits the mature CMOS fabrication process from the electronic integrated circuit (IC) industry. However, this process also limits the PIC structure to a single-waveguide-layer configuration.…
A systematic approach for high-speed via transition design is proposed. The effects of via barrel radius, anti-pad size, and the distance from adjacent stitching (GND) vias on bandwidth are analyzed and characterized. Guidelines for…
Understanding ion-transport under molecular confinement is essential for developing next-generation energy technologies, where ionic motion often occurs within nanoscale or angstrom-scale channels. In this study, we use the model system of…
In semiconductor packaging, accurately recovering 3D information is crucial for non-destructive testing (NDT) to localize circuit defects. This paper presents a novel approach called the 3D Magnetic Inverse Routine (3D MIR), which leverages…
We study the multi-user massive multiple-input-single-output (MISO) and focus on the downlink systems where the base station (BS) employs hybrid analog-digital precoding with low-cost 1-bit digital-to-analog converters (DACs). In this…
This work presents a combined analytical and simulation-based study of a 3D-integrated quantum chip architecture. We model a flip-chip-inspired structure by stacking two superconducting qubits fabricated on separate high-resistivity silicon…
Matrix-multiplication units (MXUs) are now prevalent in every computing platform. The key attribute that makes MXUs so successful is the semiring structure, which allows tiling for both parallelism and data reuse. Nonetheless,…
Multimode interference reflectors (MIRs) were recently introduced as a new type of photonic integrated devices for on-chip, broadband light reflection. In the original proposal, different MIRs were demonstrated based on total internal…
Designing systems with large magnetic anisotropy energy (MAE) is desirable and critical for nanoscale magnetic devices. A recent breakthrough achieved the theoretical limit of the MAE for 3$d$ transition metal atoms by placing a single Co…
The growing demand for controllable outputs in text-to-image generation has driven significant advancements in multi-instance generation (MIG), enabling users to define both instance layouts and attributes. Currently, the state-of-the-art…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However,…
Molybdenum disulfide is considered as one of the most promising two-dimensional semiconductors for electronic and optoelectronic device applications. So far, the charge transport in monolayer molybdenum disulfide is dominated by extrinsic…
The oversampling technique has been shown to increase the SNR and is used in many high-performance systems such as in the ADC for audio and DAT systems. This paper presents the design of the decimation and it's VLSI implementation which is…