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Photonic crystal (PhC) cavities are promising candidates for Si photonics integrated circuits due to their ultrahigh quality (Q)-factors and small mode volumes. Here, we demonstrate a novel concept of a one-dimensional hybrid III-V/Si PhC…
In this paper we develop an analytical framework for the study of electrochemical impedance of mixed ionic and electronic conductors (MIEC). The framework is based on first-principles and it features the coupling of electrochemical…
Recent nano-technological advances enable the Monolithic 3D (M3D) integration of multiple memory and logic layers in a single chip, allowing for fine-grained connections between layers and significantly alleviating main memory bottlenecks.…
We report the first Vivaldi arrays monolithically fabricated exclusively using commercial, low-cost, 3D metal printing (direct metal laser sintering). Furthermore, we developed one of the first dual-polarized Vivaldi arrays on a triangular…
The rapid growth of AI-based Internet-of-Things applications increased the demand for high-performance edge processing engines on a low-power budget and tight area constraints. As a consequence, vector processor architectures, traditionally…
We demonstrate a gate dielectric engineering approach leveraging an ultrathin, atomic layer deposited (ALD) silicon oxide interfacial layer (SiL) between the amorphous oxide semiconductor (AOS) channel and the high-k gate dielectric. SiL…
We propose a flat, analytic, mixed-size placement algorithm ePlace-3D for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) electrostatics based 3D density function with globally uniform…
In recent years, densifying multiple-input multiple-output (MIMO) has attracted much attention from the communication community. Thanks to the subwavelength antenna spacing, the strong correlations among densifying antennas provide…
Atomically thin two-dimensional (2D) materials are promising candidates for sub-10 nm transistor channels due to their ultrathin body thickness, which results in strong electrostatic gate control. Properly scaling a transistor technology…
Magnetically induced (MI) transitions (F${}_{g}$ = 1 $\rightarrow$ F${}_{e}$= 3) of ${}^{87}$Rb D${}_{2}$ line are among the most promising atomic transitions for applications in laser physics. They reach their maximum intensity in the…
Flow-based 3D generation models typically require dozens of sampling steps during inference. Though few-step distillation methods, particularly Consistency Models (CMs), have achieved substantial advancements in accelerating 2D diffusion…
Memristive Processing In-Memory (PIM) is one of the promising techniques for overcoming the Von-Neumann bottleneck. Reduction of data transfer between processor and memory and data processing by memristors in data-intensive applications…
Recently, metamaterials-inspired diffraction gratings (or metagratings) have demonstrated unprecedented efficiency in wavefront manipulation by means of relatively simple structures. Conventional one-dimensional (1D) gratings have a profile…
This paper studies the estimation of cascaded channels in passive intelligent reflective surface (IRS)- aided multiple-input multiple-output (MIMO) systems employing hybrid precoders and combiners. We propose a low-complexity solution that…
Intelligent metasurfaces may be harnessed for realizing efficient holographic multiple-input and multiple-output (MIMO) systems, at a low hardware-cost and high energy-efficiency. As part of this family, we propose a hybrid beamforming…
The surface state of a 3D topological insulator (3DTI) is a spin-momentum locked conductive state, whose large spin hall angle can be used for the energy-efficient spin orbit torque based switching of an overlying ferromagnet (FM).…
This paper reports on 3D-printed dielectric image lines for low-loss subTHz applications between 140 and 220 GHz. In contrast to conventional dielectric waveguides, a conductive copper substrate is used to achieve robust routing and…
Recent reports on machine learning (ML) and machine vision (MV) devices have demonstrated the potentials of 2D materials and devices. Yet, scalable 2D devices are being challenged by contact resistance and Fermi Level Pinning (FLP), power…
We develop a theory for the compressibility of the surface states of 3D topological insulators and propose that surface probes of the compressibility via scanning single electron transistor microscopy will be a straightforward way to access…
Oxide heterostructures represent a unique playground for triggering the emergence of novel electronic states and for implementing new device concepts. The discovery of 2D conductivity at the $LaAlO_3/SrTiO_3$ interface has been linking for…