Related papers: Evaluation of HPK $n^+$-$p$ planar pixel sensors f…
The phase 1 upgrade of the CMS pixel detector has been designed to maintain the tracking performance at instantaneous luminosities of $2 \times 10^{34} \mathrm{~cm}^{-2} \mathrm{~s}^{-1}$. Both barrel and endcap disk systems now feature one…
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about…
The planned HL-LHC (High Luminosity LHC) in 2025 is being designed to maximise the physics potential through a sizable increase in the luminosity up to 6*10^34 cm^-2 s^-1. A consequence of this increased luminosity is the expected radiation…
The ATLAS experiment at the LHC will replace its current inner tracker system for the HL-LHC era. 3D silicon pixel sensors are being considered as radiation-hard candidates for the innermost layers of the new fully silicon-based tracking…
During Phase-2 of the LHC, known as the High Luminosity LHC (HL-LHC), the accelerator will increase its instantaneous luminosity to 5 $\times$ 10$^{34}$ cm$^{-2}$ s$^{-1}$, delivering an integrated luminosity of 3000 fb$^{-1}$ over 10 years…
To fully exploit the increased luminosity of the HL-LHC, the CMS Inner Tracker is undergoing a major upgrade to withstand extreme radiation levels and data rates, while improving granularity and reducing material budget. The upgraded…
We report on the 3-year INFN ATLAS-CMS joint research activity in collaboration with FBK, started in 2014, and aimed at the development of new thin pixel detectors for the High Luminosity LHC Phase-2 upgrades. The program is concerned with…
The CMS experiment at the CERN LHC will be upgraded to accommodate the 5-fold increase in the instantaneous luminosity expected at the High-Luminosity LHC (HL-LHC). Concomitant with this increase will be an increase in the number of…
In preparation for the High Luminosity LHC, the entire tracker detector of the CMS experiment will be exchanged as part of the Phase-2 Upgrade. The new Outer Tracker will comprise approximately 13,000 silicon sensor modules, of which 7608…
The CMS collaboration is building a new inner tracking pixel detector for the High-Luminosity LHC. Each pixel readout chip will be controlled with a single serial input stream at 160 Mbps and will send out data via four current mode logic…
The Large Hadron Collider (LHC) at CERN will undergo major upgrades to increase the instantaneous luminosity up to 5-7.5$\times10^{34}$ cm$^{-2}$s$^{-1}$. This High Luminosity upgrade of the LHC (HL-LHC) will deliver a total of 3000-4000…
The planned upgrade of the LHC accelerator at CERN, namely the high luminosity (HL) phase of the LHC (HL-LHC foreseen for 2023), will result in a more intense radiation environment than the present tracking system was designed for. The…
For the high luminosity phase of the Large Hadron Collider to start operation around 2026, a major upgrade of the ATLAS Inner Tracker (ITk) is in preparation. Thanks to their low power dissipation and high charge-collection efficiency after…
In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area…
The replacement of the existing endcap calorimeter in the Compact Muon Solenoid (CMS) detector for the high-luminosity LHC (HL-LHC), scheduled for 2027, will be a high granularity calorimeter. It will provide detailed position, energy, and…
The upgrade of the LHC to the High-Luminosity LHC (HL-LHC) is expected to increase the current instantaneous luminosity by a factor of 5 to 7, providing the opportunity to study rare processes and measure precisely the standard model…
To cope with the higher occupancy and radiation damage at the HL-LHC also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project (PPS) is an international collaboration of 17 institutions and more than 80…
We present the results of the characterization of silicon pixel modules employing n-in-p planar sensors with an active thickness of 150 $\mathrm{\mu}$m, produced at MPP/HLL, and 100-200 $\mathrm{\mu}$m thin active edge sensor devices,…
We present the results of the characterization of novel n-in-p planar pixel detectors, designed for the future upgrades of the ATLAS pixel system. N-in-p silicon devices are a promising candidate to replace the n-in-n sensors thanks to…
The CMS experiment will include a pixel detector for pattern recognition and vertexing. It will consist of three barrel layers and two endcaps on each side, providing three space-points up to a pseudoraditity of 2.1. Taking into account the…