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Related papers: MuPix and ATLASPix -- Architectures and Results

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The ATLAS experiment will undergo around the year 2025 a replacement of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) with a new 5-layer pixel system. Thin planar pixel sensors are promising candidates to…

Instrumentation and Detectors · Physics 2017-02-01 Anna Macchiolo , Julien Beyer , Alessandro La Rosa , Richard Nisius , Natascha Savic

The present Compact Muon Solenoid silicon pixel tracking system has been designed for a peak luminosity of 1034cm-2s-1 and total dose corresponding to two years of the Large Hadron Collider (LHC) operation. With the steady increase of the…

Instrumentation and Detectors · Physics 2011-10-11 N. Parashar

The ATLAS experiment at the LHC will replace its current inner tracker system for the HL-LHC era. 3D silicon pixel sensors are being considered as radiation-hard candidates for the innermost layers of the new fully silicon-based tracking…

Instrumentation and Detectors · Physics 2019-09-04 S. Terzo , M. Chmeissani , G. Giannini , S. Grinstein , M. Manna , G. Pellegrini , D. Quirion , D. Vazquez Furelos

In MicroPattern Gas Detectors (MPGD) when the pixel size is below 100 micron and the number of pixels is large (above 1000) it is virtually impossible to use the conventional PCB read-out approach to bring the signal charge from the…

Instrumentation and Detectors · Physics 2015-06-26 R. Bellazzini , F. Angelini , L. Baldini , F. Bitti , A. Brez , L. Latronico , M. M. Massai , M. Minuti , N. Omodei , M. Razzano , C. Sgro , G. Spandre , E. Costa , P. Soffitta

In order to increase its discovery potential, the Large Hadron Collider (LHC) accelerator will be upgraded in the next decade. The high luminosity LHC (HL-LHC) period demands new sensor technologies to cope with increasing radiation…

Instrumentation and Detectors · Physics 2017-02-01 D. Vázquez Furelos , M. Carulla , E. Cavallaro , F. Förster , S. Grinstein , J. Lange , I. López Paz , M. Manna , G. Pellegrini , D. Quirion , S. Terzo

MALTA2 is the latest full-scale prototype of the MALTA family of Depleted Monolithic Active Pixel Sensors (DMAPS) produced in Tower Semiconductor 180 nm CMOS technology. In order to comply with the requirements of High Energy Physics (HEP)…

MAPS, MMT Adaptive optics exoPlanet characterization System, is the upgrade of legacy 6.5m MMT adaptive optics system. It is an NSF MSIP-funded project that includes (i) refurbishing of the MMT Adaptive Secondary Mirror (ASM), (ii) new high…

The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) foreseen to start around 2025. Thin planar pixel modules are promising candidates to instrument the new pixel…

Instrumentation and Detectors · Physics 2017-03-08 N. Savic , L. Bergbreiter , J. Breuer , A. La Rosa , A. Macchiolo , R. Nisius , S. Terzo

We present the design and the performance of MUX64, a 64-to-1 analogue multiplexer ASIC for the ATLAS High Granularity Timing Detector (HGTD). The MUX64 transmits one of its 64 inputs selected by six address lines for the voltages or…

Instrumentation and Detectors · Physics 2023-03-29 Zifeng Xu , Li Zhang , Xing Huang , Qiyu Sha , Zhenwu Ge , Yimin Che , Datao Gong , Suen Hou , Jie Zhang , Tiankuan Liu , Zhijun Liang , Lei Zhang , Jingbo Ye , Ming Qi

Allpix$^2$ (read: Allpix Squared) is a generic, open-source software framework for the simulation of silicon pixel detectors. Its goal is to ease the implementation of detailed simulations for both single detectors and more complex setups…

The development of CMOS pixel sensors with column parallel read-out and integrated zero-suppression has resulted in a full size, nearly 1 Megapixel, prototype with ~100 \mu s read-out time. Its performances are quite close to the ILD vertex…

Instrumentation and Detectors · Physics 2010-07-16 Christine Hu-Guo , IPHC Collaboration , IRFU Collaboration

The Inner Tracking System (ITS) of the ALICE experiment will be upgraded during the second long LHC shutdown in $\mathrm{2019}-\mathrm{2020}$. The main goal of the ALICE ITS Upgrade is to enable high precision measurements of low - momentum…

Instrumentation and Detectors · Physics 2019-05-22 D. Andreou

In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the Inner Detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation…

Instrumentation and Detectors · Physics 2015-06-05 A. La Rosa , C. Gallrapp , A. Macchiolo , R. Nisius , H. Pernegger , R. H. Richter , P. Weigell

Monolithic CMOS pixel sensors offer unprecedented opportunities for fast nano-imaging through direct electron detection in transmission electron microscopy. We present the design and a full characterisation of a CMOS pixel test structure…

A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to…

Instrumentation and Detectors · Physics 2015-06-18 Dominik Dannheim

The foreseen luminosity upgrade for the LHC (a factor of 5-10 more in peak luminosity by 2021) poses serious constraints on the technology for the ATLAS tracker in this High Luminosity era (HL-LHC). In fact, such luminosity increase leads…

Instrumentation and Detectors · Physics 2012-11-01 The ATLAS Planar Pixel Sensor R&D Project , : , M. Bomben

Progress is reported on the development and testing of Monolithic Active Pixel Sensors (MAPS) for a Si-W ECAL for the ILC. Using laser and source setups, a first version of the sensor has been characterised through measurements of the…

This article documents the characteristics of the high voltage (HV) system of the hadronic calorimeter TileCal of the ATLAS experiment. Such a system is suitable to supply reliable power distribution into particles physics detectors using a…

For the Inner Tracking System 3 (ITS3) upgrade, the ALICE experiment at CERN requires monolithic active pixel sensors of dimensions up to 97~mm$\,\times\,$266~mm, occupying a large fraction of a 300 mm wafer. To manufacture such a…

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