Related papers: Inter-Tier Process Variation-Aware Monolithic 3D N…

As Large Language Models (LLMs) continue to evolve, Mixture of Experts (MoE) architecture has emerged as a prevailing design for achieving state-of-the-art performance across a wide range of tasks. MoE models use sparse gating to activate…

The Mixture-of-Experts (MoE) models have emerged as the state-of-the-art paradigm for scaling up large language models (LLMs) without proportionally increased computational cost. However, its on-device deployment faces a critical challenge…

To achieve high accuracy, convolutional neural networks (CNNs) are increasingly growing in complexity and diversity in layer types and topologies. This makes it very challenging to efficiently deploy such networks on custom processor…

3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D stacking promises potential gains in performance, power and…

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…

3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…

Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…

Monolithic 3D integration has become a promising solution for future computing needs. The metal inter-layer via (MIV) forms interconnects between substrate layers in Monolithic 3D integration. Despite small size of MIV, the area overhead…

Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…

Three-dimensional integrated circuits promise power, performance, and footprint gains compared to their 2D counterparts, thanks to drastic reductions in the interconnects' length through their smaller form factor. We can leverage the…

Photonic technologies have shown a promising way to build high-speed and high-energy-efficiency neural network accelerators. In previously presented photonic neural networks, architectures are mainly designed for fully-connected layers.…

Networks-on-chip (NoCs) have become the standard for interconnect solutions in industrial designs ranging from client CPUs to many-core chip-multiprocessors. Since NoCs play a vital role in system performance and power consumption,…

Optimal multi-layer device design requires consideration of fabrication uncertainties associated with inter-layer alignment and conformal layering. We present layer-restricted topology optimization (TO), a novel technique which mitigates…

Carbon Nanotubes (CNTs)-polymer composites are promising candidates for a myriad of applications. Ad-hoc CNTs-polymer composite fabrication techniques inherently pose roadblock to optimized processing resulting in microstructural defects…

Metal inter-layer via (MIV) in Monolithic three-dimensional integrated circuits (M3D-IC) is used to connect inter-layer devices and provide power and clock signals across multiple layers. The size of MIV is comparable to logic gates because…

The MultiNoC system implements a programmable on-chip multiprocessing platform built on top of an efficient, low area overhead intra-chip interconnection scheme. The employed interconnection structure is a Network on Chip, or NoC. NoCs are…

The consistent demand for better performance has lead to innovations at hardware and microarchitectural levels. 3D stacking of memory and logic dies delivers an order of magnitude improvement in available memory bandwidth. The price paid…

Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enables more opportunities to architect 3DICs with different die…

With the advent of modern multi-chiplet FPGA architectures, vendors have begun integrating hardened NoC to address the scalability, resource usage, and frequency disadvantages of soft NoCs. However, as this work shows, effectively…

Ni-based superalloy Inconel-718 is ubiquitous in metal 3D printing where high cooling rate and thermal gradient are present. These manufacturing conditions are conducive to high initial dislocation density and porosity or void in the…