Related papers: 3D Integration: Another Dimension Toward Hardware …
As many industries shift towards centralised controlled information systems for monitoring and control, more importance is being placed upon technologies such as Supervisory Control and Data Acquisitions industrial systems (SCADA). This…
AI systems have found a wide range of real-world applications in recent years. The adoption of edge artificial intelligence, embedding AI directly into edge devices, is rapidly growing. Despite the implementation of guardrails and safety…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
Cyber-physical systems (CPS) are composed of various embedded subsystems and require specialized software, firmware, and hardware to coordinate with the rest of the system. These multiple levels of integration expose attack surfaces which…
3D integration has the potential to improve the scalability and performance of Chip Multiprocessors (CMP). A closed form analytical solution for optimizing 3D CMP cache hierarchy is developed. It allows optimal partitioning of the cache…
Three-dimensional (3D) applications have come to every corner of life. We present 3DTouch, a novel 3D wearable input device worn on the fingertip for interacting with 3D applications. 3DTouch is self-contained, and designed to universally…
Integrated circuits (ICs) are the foundation of all computing systems. They comprise high-value hardware intellectual property (IP) that are at risk of piracy, reverse-engineering, and modifications while making their way through the…
The advancement of manufacturing technologies has enabled the integration of more intellectual property (IP) cores on the same system-on-chip (SoC). Scalable and high throughput on-chip communication architecture has become a vital…
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in how computer systems are designed, implemented, scaled, and used. Since Moores Law,…
Implantable Medical Devices (IMD) is a fast pace growing medical field and continues to grow in the foreseeable future. Advancement in science and technology has led to the IMD devices offering advanced medical treatments. Modern IMDs can…
The rise of hardware-level security threats, such as side-channel attacks, hardware Trojans, and firmware vulnerabilities, demands advanced detection mechanisms that are more intelligent and adaptive. Traditional methods often fall short in…
Biometric authentication systems are presented as the best way to reach high security levels in controlling access to IT systems or sensitive infrastructures. But several issues are often not taken properly into account. In order for the…
Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled…
Pushed by market forces, software development has become fast-paced. As a consequence, modern development projects are assembled from 3rd-party components. Security & privacy assurance techniques once designed for large, controlled updates…
Hybrid systems are integrations of discrete computation and continuous physical evolution. The physical components of such systems introduce safety requirements, the achievement of which asks for the correct monitoring and control from the…
Security is an important facet of integrated circuit design for many applications. IP privacy and Trojan insertion are growing threats as circuit fabrication in advanced nodes almost inevitably relies on untrusted foundries. A proposed…
Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and…
To reduce the cost of ICs and to meet the market's demand, a considerable portion of manufacturing supply chain, including silicon fabrication, packaging and testing may be pushed offshore. Utilizing a global IC manufacturing supply chain,…
The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase…