Related papers: Thermal Management in Fine-Grained 3-D Integrated …
Existing algorithms with iterations as the principle for 3D inverse heat conduction problems (IHCPs) are usually time-consuming. With the recent advancements in deep learning techniques, it is possible to apply the neural network to compute…
Geothermal energy, a promising renewable source, relies on efficiently utilizing geothermal reservoirs, especially in Enhanced Geothermal Systems (EGS), where fractures in hot rock formations enhance permeability. Understanding fracture…
Devices for performing computation and logic operations with low-energy consumption are of key importance for environmentally friendly data-processing and information technology. Here, we present a design for magnetic elements that use…
In recent years, three-dimensional GaN-based transistors have been intensively studied for their dramatically improved output power, better gate controllability, and shorter channels for speedup and miniaturization. However, thermal…
Thermoelectric devices are pivotal in the energy sector, with enhancing their conversion efficiency being a longstanding focal point. While progress has been made, overcoming the inherent low efficiency and heat management issues remains…
Anisotropic thermal transport plays a key role in both theoretical study and engineering practice of heat transfer, but accurately measuring anisotropic thermal conductivity remains a significant challenge. To address this issue, we propose…
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…
The pursuit of extreme miniaturization and high power in 6G RF front-ends has cast thermal dissipation as the central challenge. Here, we have demonstrated the monolithic integration of functionally distinct single-crystal thin films,…
Since the discovery of the giant magnetoresistance (GMR) effect the use of the intrinsic angular momentum of the electrons has opened up new spin based device concepts. The two channel model of spin-up and spin-down electrons with…
The three-level system represents the smallest quantum system capable of autonomous cycling in quantum heat engines. This study proposes a method to simulate the steady-state dynamics of a three-level quantum heat engine by designing and…
This paper presents a novel fault-tolerant control framework for steam temperature regulation in Heat Recovery Steam Generators (HRSGs) subject to actuator faults. Addressing the critical challenge of valve degradation in superheater spray…
Cryogenic microsystems that utilize different 3D integration techniques are being actively developed, e.g., for the needs of quantum technologies. 3D integration can introduce opportunities and challenges to the thermal management of low…
This study presents a new higher-order super-compact (HOSC) finite difference scheme for analyzing enhanced heat transfer of three-dimensional (3D) nanofluid natural convection in a cubic cavity. The unique contribution of the present work…
Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…
In the last two decades, a nanostructuring paradigm has been successfully applied in a wide range of thermoelectric materials, resulting in significant reduction in thermal conductivity and superior thermoelectric performance. These…
In this study, a time fractional dual-phase-lag model with temperature jump boundary condition as a choice for the Fourier's law replacement in thermal modeling of transistors, is utilized. In more details, the numerical simulation of heat…
Magnetic reconnection has long been known to be the most important mechanism not only for mixing the plasmas by changing the magnetic field topology but also for releasing the magnetic field energy into the plasma kinetic energy. During…
An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly…
We present a new approach for the two-temperature molecular dynamics (MD) model for coupled simulations of electronic and phonon heat conduction in nanoscale systems. The proposed method uses a master equation to perform heat conduction of…
Processing cores and the accompanying main memory working in tandem enable the modern processors. Dissipating heat produced from computation, memory access remains a significant problem for processors. Therefore, processor thermal…