Related papers: Thermal Management in Fine-Grained 3-D Integrated …
To achieve high performance thermoelectric materials and devices, thermoelectric transistors, which integrate thermoelectric effects with transistor technology, represent a promising approach. Here p type Bi0.5Sb1.5Te3 and n type…
A suspended system for measuring the thermal properties of membranes is presented. The sensitive thermal measurement is based on the 3$\omega$ dynamic method coupled to a V$\ddot{o}$lklein geometry. The device obtained using micro-machining…
In this article we propose two novel 3D finite element models, denoted method A and B, for electron and hole Drift-Diffusion (DD) current densities. Method A is based on a primal-mixed formulation of the DD model as a function of the…
Thermal resistances from interfaces impede heat dissipation in micro/nanoscale electronics, especially for high-power electronics. Despite the growing importance of understanding interfacial thermal transport, advanced thermal…
The authors report on synthesis and thermal properties of the electrically-conductive thermal interface materials with the hybrid graphene-metal particle fillers. The thermal conductivity of resulting composites was increased by ~500% in a…
Using the atmospheric structure from a 3D global radiation-hydrodynamic simulation of HD 189733b and the open-source BART code, we investigate the difference between the secondary-eclipse temperature structure produced with a 3D simulation…
Thermoelectric conductance of an edge mode is investigated. The edge modes of a $2D $ and $3D$ two band model with parabolic dispersion is considered. For the the one dimensional non interacting fermions the thermal conductivity computed…
We make progress towards a 3D finite-element model for the magnetization of a high temperature superconductor (HTS): We suggest a method that takes into account demagnetisation effects and flux creep, while it neglects the effects…
Thermoelectric material provides a high hope for converting harmful and useless heat into useful energy, electricity. It can also be used as solid state Peltier coolers in integrated circuits, an outstanding challenge for electronic…
The focal plane assembly of wavefront camera is the key imaging device of wavefront detection camera and the key load of the exoplanet imaging coronagraph module. In order to ensure the imaging quality and reduce the dark current and…
3D additive manufacturing enables the fabrication of nanophotonic structures with subwavelength features that control light across macroscopic scales. Gradient-based optimization offers an efficient approach to design these complex and…
While parallel microchannel based cooling systems have been around for quite a period of time, employing the same and incorporating them for near active cooling of microelectronic devices is yet to be implemented and the implications of the…
Advanced 3D radiative MHD simulations now reproduce many properties of the outer solar atmosphere. When including a domain from the convection zone into the corona, a hot chromosphere and corona are self-consistently maintained. Here we…
Recent advances in our understanding of thermal transport in nanocrystalline systems are responsible for the integration of new technologies into advanced energy systems, including thermoelectric refrigeration systems and renewable energy…
In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effec-tive dissipation of heat. This can be achieved by the optimization of the system design…
Toward measuring the thermal properties of exfoliated atomically thin materials, we demonstrate simultaneous measurements of the thermal conductivity and specific heat in suspended membranes. We use the 3{\omega} technique applied to…
Superheated steam is widely employed in various energy systems, particularly in power plants, chemical industries, and other applications where high-temperature and high-pressure steam is essential for efficient energy conversion and…
Accurate on-chip temperature sensing is critical for the optimal performance of modern CMOS integrated circuits (ICs), to understand and monitor localized heating around the chip during operation. The development of quantum computers has…
Monolithic Three-Dimensional Integrated Circuits (M3D-IC) has become an attractive option to increase the transistor density. In M3D-IC, substrate layers are realized on top of previous layers using sequential integration techniques. Recent…
Advances in nanosheet technologies have significantly increased power densities, exacerbating thermal management challenges in 2.5D/3D chiplet-based Systems-in-Package (SiP). While traditional thermal analyses often employ uniform power…