Related papers: Thermal Management in Fine-Grained 3-D Integrated …
We propose an optimal operation control strategy for an electro-thermal microgrid. Compared to existing work, our approach increases flexibility by operating the thermal network with variable flow temperatures and in that way explicitly…
With increased power consumption of modern computer components, heat-based circuitry has become ever more relevant due to a lower power expense to process logic bits of information. In heat-based circuits, computations are performed by…
Phononic silicon structures have emerged as an integrable and scalable nanosystem for tailoring thermal transport. However, their widespread adoption has been limited by their complex fabrication pathways. Alongside, the reliable…
Overheating has emerged as a primary challenge constraining the reliability and performance of next-generation high-performance electronics, such as chiplets and (ultra)wide bandgap electronics. Advanced heterogeneous integration not only…
The finite element method is widely used in simulations of various fields. However, when considering domains whose extent differs strongly in different spatial directions a finite element simulation becomes computationally very expensive…
Active thermal control is crucial in achieving the required accuracy and throughput in many industrial applications, e.g., in the medical industry, high-power lighting industry, and semiconductor industry. Thermoelectric Modules (TEMs) can…
This paper demonstrates the use of voltage noise thermometry, with a cross-correlation technique, as a dissipation-free method of thermometry inside a CMOS integrated circuit (IC). We show that this technique exhibits broad agreement with…
In this article we review the thermoelectric properties of three terminal devices with Coulomb coupled quantum dots (QDs) as observed in recent experiments [1,2]. The system we consider consists of two Coulomb-blockade QDs one of which can…
One of the crucial steps in the design of an integrated circuit is the minimization of heating and temperature non-uniformity. Current temperature calculation methods, such as finite element analysis and resistor networks have considerable…
Efficient thermal management is critical for cryogenic CMOS circuits, where local heating can compromise device performance and qubit coherence. Understanding heat flow at the nanoscale in these multilayer architectures requires localized,…
The modeling and analysis of superconducting coils is an essential task in the design stage of most devices based on high-temperature superconductors (HTS). These calculations allow verifying basic estimations and assumptions, proposing…
Heat transfer in semiconductor devices is dominated by chip and substrate assemblies, where heat generated within a finite chip layer dissipates into a semi-infinite substrate with much higher thermophysical properties. This mismatch…
Navigating the intricacies of thermal management at the quantum scale is a challenge in the pursuit of advanced nanoscale technologies. To this extent, theoretical frameworks introducing minimal models mirroring the functionality of…
As the technology node continues to shrink, nanosheet field effect transistors (NSFETs) and complementary FETs (CFETs) become valid candidates for the 3nm and sub-nanometre nodes. However, due to the shrinking device size, self-heating and…
Improving the heat transfer coefficient is crucial across various energy utilization processes for maintaining device safety and stability with high energy efficiency. However, in scenarios with limited heat capacity flow rates, increasing…
Electric-field-induced ion heating is a major obstacle in scalable trapped-ion quantum computing. We present a theoretical study of a novel 3D-printed ion trap with a skeleton electrode structure, designed to reduce heating by minimizing…
This work proposes an extension of phase change and latent heat models for the simulation of metal powder bed fusion additive manufacturing processes on the macroscale and compares different models with respect to accuracy and numerical…
In this study, we advance the understanding of non-equilibrium systems by deriving thermodynamic relations for a heat engine operating under an exponentially decreasing temperature profile. Such thermal configurations closely mimic…
As the demand for computational power increases, high-bandwidth memory (HBM) has become a critical technology for next-generation computing systems. However, the widespread adoption of HBM presents significant thermal management challenges,…
We report the superconducting properties of tantalum nitride (TaN) nanowires and TaN/copper (TaN/Cu) bilayer nanowires fabricated on 300 mm silicon wafers using CMOS-compatible processes. We evaluate how an integrated Cu heatsink modifies…