An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly pressures. This is achieved using nested hierarchical surface channels to control the particle stacking with highly particle-filled materials. Reliability testing with thermal cycling has also demonstrated a decrease in thermal resistance after extended times with longer overall lifetime compared to a flat interface.
@article{arxiv.0801.1046,
title = {High Performance Thermal Interface Technology Overview},
author = {R. Linderman and T. Brunschwiler and B. Smith and B. Michel},
journal= {arXiv preprint arXiv:0801.1046},
year = {2008}
}
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Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)