Related papers: Semiconductor characterization by scanning ion bea…
A major security threat to an integrated circuit (IC) design is the Hardware Trojan attack which is a malicious modification of the design. Previously several papers have investigated into side-channel analysis to detect the presence of…
Seebeck coefficient is a widely-studied semiconductor property. Conventional Seebeck coefficient measurements are based on DC voltage measurement. Normally this is performed on samples with low resistances below a few Mohm level. Meanwhile,…
Charge transport in amorphous semiconductors is considerably more complicated than process in crystalline materials due to abundant localized states. In addition to device-scale characterization, spatially resolved measurements are…
The extremely low dark current of silicon carbide (SiC) detectors, even after high-fluence irradiation, was utilized to develop a beam monitoring system for a wide range of particle rates, i.e., from the kHz to the GHz regime. The system is…
This paper describes a comprehensive experimental study on viability and prospects for the measurement of electroweak observables in $e^{+}e^{-}\rightarrow b\bar{b}$ and $e^{+}e^{-}\rightarrow c\bar{c}$ processes at the International Linear…
Nanoscale fabrication and characterisation techniques critically underpin a vast range of fields, including materials science, nanoelectronics and nanobiotechnology. Focused ion beam (FIB) techniques are particularly appealing due to their…
The development of modern metal deposition techniques like Focused Ion/Electron Beam Induced Deposition FIBID/FEBID relies heavily on the availability of metal-organic precursors of particular properties. To create a new precursor,…
Traditional image acquisition for cryo focused ion-beam scanning electron microscopy tomography often sees thousands of images being captured over a period of many hours, with immense data sets being produced. When imaging beam sensitive…
The extreme sensitivity of 2D materials to defects and nanostructure requires precise imaging techniques to verify presence of desirable and absence of undesirable features in the atomic geometry. Helium-ion beams have emerged as a…
This paper introduces the Infra-Red, In Situ (IRIS) inspection method, which uses short-wave IR (SWIR) light to non-destructively "see through" the backside of chips and image them with lightly modified conventional digital CMOS cameras.…
This monograph describes nine years of research carried out at the Institute for Electronics, Micro-electronics and Nanotechnologies (IEMN), developed around defining a generic concept for detection, filling a void between metrological…
Independent Component Analysis (ICA) is a statistical method often used to decompose a complex dataset in its independent sub-parts. It is a powerful technique to solve a typical Blind Source Separation problem. A fast calculation of the…
Electrochemical Impedance Spectroscopy (EIS) and Equivalent Circuit Models (ECMs) are widely used to characterize the impedance and estimate parameters of electrochemical systems such as batteries. We use a generic ECM with ten parameters…
The EIC Comprehensive Chromodynamics Experiment (ECCE) detector has been designed to address the full scope of the proposed Electron Ion Collider (EIC) physics program as presented by the National Academy of Science and provide a deeper…
Superconducting resonators with high quality factors are extremely sensitive detectors of the complex impedance of materials and devices coupled to them. This capability has been used to measure losses in multiple different materials and,…
The highly granular silicon-tungsten electromagnetic calorimeter (SiW ECAL) is the reference design of the ECAL for the International Large Detector (ILD) concept, one of the two detector concepts proposed for the future International…
In general, the labels used in sequence labeling consist of different types of elements. For example, IOB-format entity labels, such as B-Person and I-Person, can be decomposed into span (B and I) and type information (Person). However,…
The independent atom model - pixel counting method (IAM-PCM) for the description of ion-molecule collisions is reviewed. The method was introduced (in 2016) to improve on the simple additivity rule according to which scattering cross…
We present an innovative charge detector with high resolution and wide dynamic range designed to fulfill the requirements of a monitoring system for a high energy ion beam. The detector prototype, constructed using Si photodiodes and a…
Depth profiling of graphene with high-resolution ion beam analysis is a practical method for analysis of monolayer thicknesses of graphene. Not only is the energy resolution sufficient to resolve graphene from underlying SiC, but by use of…