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As critical transportation infrastructure, bridges face escalating challenges from aging and deterioration, while traditional manual inspection methods suffer from low efficiency. Although 3D point cloud technology provides a new…
This work implements a hybrid device based on a semiconductor quantum dot embedded within a nanowire to bridge a non-continuous curved waveguide structure. The geometry takes advantage of evanescent coupling between the photonic structures…
Main memories play an important role in overall energy consumption of embedded systems. Using conventional memory technologies in future designs in nanoscale era causes a drastic increase in leakage power consumption and temperature-related…
We present CrossLoc3D, a novel 3D place recognition method that solves a large-scale point matching problem in a cross-source setting. Cross-source point cloud data corresponds to point sets captured by depth sensors with different…
3D DRAM has emerged as a promising approach for continued density scaling, but its viability is limited by routing and hybrid bonding constraints to periphery, which may degrade sensing margin, latency, and array efficiency. With device…
The 2D/3D construction of hybrid perovskite interfaces is gaining increasing attention due to their enhanced stability towards degradation without compromising the corresponding solar cell efficiency. Much of it is due to the interfacial…
The first contribution of this paper is the development of extremely dense, energy-efficient mixed-signal vector-by-matrix-multiplication (VMM) circuits based on the existing 3D-NAND flash memory blocks, without any need for their…
This study presents a new higher-order super-compact (HOSC) finite difference scheme for analyzing enhanced heat transfer of three-dimensional (3D) nanofluid natural convection in a cubic cavity. The unique contribution of the present work…
This work introduces Open3DBench, an open-source 3D-IC backend implementation benchmark built upon the OpenROAD-flow-scripts framework, enabling comprehensive evaluation of power, performance, area, and thermal metrics. Our proposed flow…
Self-assembly of complex and functional materials remains a grand challenge in soft material science. Efficient assembly depends on a delicate balance between thermodynamic and kinetic effects, requiring fine-tuning affinities and…
The Network-on-Chip (NoC) paradigm has been proposed as a favorable solution to handle the strict communication requirements between the increasingly large number of cores on a single chip. However, NoC systems are exposed to the aggressive…
Fusing LiDAR and camera information is essential for achieving accurate and reliable 3D object detection in autonomous driving systems. This is challenging due to the difficulty of combining multi-granularity geometric and semantic features…
Stereoscopic 3D (S3D) displays provide an additional sense of depth compared to non-stereoscopic displays by sending slightly different images to the two eyes. But conventional S3D displays do not reproduce all natural depth cues. In…
Systolic arrays are popular for executing deep neural networks (DNNs) at the edge. Low latency and energy efficiency are key requirements in edge devices such as drones and autonomous vehicles. Monolithic 3D (MONO3D) is an emerging 3D…
Memories that exploit three-dimensional (3D)-stacking technology, which integrate memory and logic dies in a single stack, are becoming popular. These memories, such as Hybrid Memory Cube (HMC), utilize a network-on-chip (NoC) design for…
In this paper, we present an efficient adaptive multigrid strategy for the geometry optimization of large-scale three dimensional molecular mechanics. The resulting method can achieve significantly reduced complexity by exploiting the…
Inspired by the challenge of scaling up existing silicon quantum hardware, we investigate compilation strategies for sparsely-connected 2d qubit arrangements and propose a spin-qubit architecture with minimal compilation overhead. Our…
The development of superconducting qubit technology has shown great potential for the construction of practical quantum computers. As the complexity of quantum processors continues to grow, the need for stringent fabrication tolerances…
We have performed an x-ray holotomography study of a three-dimensional (3D) photonic band gap crystal. The crystals was made from silicon by CMOS-compatible methods. We manage to obtain the 3D material density throughout the fabricated…
Artificial intelligence (AI) hardware is positioned to unlock revolutionary computational abilities across diverse fields ranging from fundamental science [1] to medicine [2] and environmental science [3] by leveraging advanced…