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Most 3D Gaussian Splatting (3D-GS) based methods for urban scenes initialize 3D Gaussians directly with 3D LiDAR points, which not only underutilizes LiDAR data capabilities but also overlooks the potential advantages of fusing LiDAR with…
Hybrid bonding is a pivotal technology for enabling three dimensional integrated circuits. Among the foremost challenges facing 3D IC implementation is thermal management, where a deep understanding of heat conduction across bonded…
As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may require, access via the third dimension to alleviate…
In multilevel 3D integrated packaging, three major microstructures are viable due to the application of low volume of solders in different sizes, and/or processing conditions. Thermodynamics and kinetics of binary compounds in Cu/Sn/Cu low…
The exploration of dimensional crossover carries profound fundamental significance, serving as a crucial bridge in comprehending the remarkable disparities observed in transitional phenomena across the two distinct dimensions of a physical…
3D structure modeling is essential across scales, enabling applications from fluid simulation and 3D reconstruction to protein folding and molecular docking. Yet, despite shared 3D spatial patterns, current approaches remain fragmented,…
Nowadays three dimension (3D) architectural visualisation has become a powerful tool in the conceptualisation, design and presentation of architectural products in the construction industry, providing realistic interaction and walkthrough…
3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal…
A novel class of photonic integrated circuits employs large-scale integration of combined beam splitters and waveguides loaded with phase actuators to provide complex linear processing functionalities that can be reconfigured dynamically.…
Monolithic 3D integration has become a promising solution for future computing needs. The metal inter-layer via (MIV) forms interconnects between substrate layers in Monolithic 3D integration. Despite small size of MIV, the area overhead…
In this work, we present a numerical model specifically designed for 3D multilayer devices, with a focus on nanobridge junctions and coplanar waveguides. Unlike existing numerical models, ours does not approximate the physical layout or…
Disentangling attributes of various sensory signals is central to human-like perception and reasoning and a critical task for higher-order cognitive and neuro-symbolic AI systems. An elegant approach to represent this intricate…
Generalizing open-vocabulary 3D instance segmentation (OV-3DIS) to diverse, unstructured, and mesh-free environments is crucial for robotics and AR/VR, yet remains a significant challenge. We attribute this to two key limitations of…
Waveguide crossings represent one of the most critical components in very-large-scale photonic integration (VLSPI). Three-dimensional waveguide crossings, which distribute optical pathways across multiple planes, can achieve near-zero…
Integrated micro-nanochannel networks in fluidic devices are desirable in a number of applications ranging from self-healing/cooling materials to bioengineering. The conventional micro-manufacturing techniques are capable of either…
Three-dimensional (3D) topological Dirac semimetal, when thinned down to 2D few layers, is expected to possess gapped Dirac nodes via quantum confinement effect and concomitantly display the intriguing quantum spin Hall (QSH) insulator…
Unlike closed-vocabulary 3D instance segmentation that is often trained end-to-end, open-vocabulary 3D instance segmentation (OV-3DIS) often leverages vision-language models (VLMs) to generate 3D instance proposals and classify them. While…
Spiking neural networks (SNNs) are powerful models of spatiotemporal computation and are well suited for deployment on resource-constrained edge devices and neuromorphic hardware due to their low power consumption. Leveraging attention…
Airborne acquisition and on-road mobile mapping provide complementary 3D information of an urban landscape: the former acquires roof structures, ground, and vegetation at a large scale, but lacks the facade and street-side details, while…
We report high qubit coherence as well as low crosstalk and single-qubit gate errors in a superconducting circuit architecture that promises to be tileable to 2D lattices of qubits. The architecture integrates an inductively shunted cavity…