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We report on the fabrication and metrology of superconducting caps for qubit circuits. As part of a 3D quantum integrated circuit architecture, a cap chip forms the upper half of an enclosure that provides isolation, increases vacuum…
3D building models are critical for applications in architecture, energy simulation, and navigation. Yet, generating accurate and semantically rich 3D buildings automatically remains a major challenge due to the lack of large-scale…
In this paper, we have experimentally demonstrated, for the first time, III-V 4D transistors with vertically stacked InGaAs nanowire (NW) channels and gate-all-around (GAA) architecture. Novel process technology enabling the transition from…
The Quantum Charge-Coupled Device (QCCD) architecture is a modular design to expand trapped-ion quantum computer that relies on the coherent shuttling of qubits across an array of segmented electrodes. Leveraging trapped ions for their long…
Current nanostructure fabrication by etching is usually limited to planar structures as they are defined by a planar mask. The realisation of three-dimensional (3D) nanostructures by etching requires technologies beyond planar masks. We…
Dense 3D convolutions provide high accuracy for perception but are too computationally expensive for real-time robotic systems. Existing tri-plane methods rely on 2D image features with interpolation, point-wise queries, and implicit MLPs,…
Next-generation electronics calls for new materials beyond silicon for increased functionality, performance, and scaling in integrated circuits. Carbon nanotubes and semiconductor nanowires are at the forefront of these materials, but have…
The advancement of concrete 3D printing (C3DP) technology has revolutionized the construction industry, offering unique opportunities for innovation and efficiency. At the heart of this process lies a comprehensive digital chain that…
Use of 2G HTS coated conductors in several power applications has become popular in recent years. Their large current density under high magnetic fields makes them suitable candidates for high power capacity applications such as stacks,…
Thermal management of integrated circuits (ICs) is important to prevent thermal hotspots which are the leading cause of IC failure. Thermal management is even more critical in 3D integrated circuits (3D ICs) as the prevalence of thermal…
The state-of-the-art CMOS technology has started to adopt three-dimensional (3D) integration approaches, enabling continuous chip density increment and performance improvement, while alleviating difficulties encountered in traditional…
Optical interconnect is a potential solution to attain the large bandwidth on-chip communications needed in high performance computers in a low power and low cost manner. Mode-division multiplexing (MDM) is an emerging technology that…
Microfluidic mixing is a fundamental functionality in most lab on a chip (LOC) systems,whereas realization of efficient mixing is challenging in microfluidic channels due to the small Reynolds numbers. Here, we design and fabricate a…
This article proposes a novel computational modeling approach for short-ranged molecular interactions between curved slender fibers undergoing large 3D deformations, and gives a detailed overview how it fits into the framework of existing…
Programmable optical circuits form a key part of quantum technologies today, ranging from transceivers for quantum communication to integrated photonic chips for quantum information processing. As the size of such circuits is increased,…
Volumetric lithography offers a path to scalable fabrication of complex three-dimensional (3D) micro- and nanoscale architectures, yet existing approaches are limited by quasi-two-dimensional exposure physics or slow serial writing. We…
Superconducting 3D microwave cavities offer state-of-the-art coherence times and a well controlled environment for superconducting qubits. In order to realize at the same time fast readout and long-lived quantum information storage, one can…
Perceiving the three-dimensional (3D) structure of the spacecraft is a prerequisite for successfully executing many on-orbit space missions, and it can provide critical input for many downstream vision algorithms. In this paper, we propose…
Mode-division multiplexing (MDM) is becoming an enabling technique for large-capacity data communications via encoding the information on orthogonal guiding modes. However, the on-chip routing of a multimode waveguide occupies too large…
Two-dimensional (2D) materials have emerged as a versatile and powerful platform for quantum technologies, offering atomic-scale control, strong quantum confinement, and seamless integration into heterogeneous device architectures. Their…