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3D point clouds are rich in geometric structure information, while 2D images contain important and continuous texture information. Combining 2D information to achieve better 3D semantic segmentation has become mainstream in 3D scene…
Photonic integration on plastic substrates enables emerging applications ranging from flexible interconnects to conformal sensors on biological tissues. Such devices are traditionally fabricated using pattern transfer, which is complicated…
Multiple-input multiple-output (MIMO) orthogonal frequency-division multiplexing (OFDM) systems rely on digital or hybrid digital and analog designs for beamforming against frequency-selective fading, which suffer from high hardware…
Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…
Dynamic 3D Gaussian splatting (3DGS) extends static 3DGS to render dynamic scenes, enabling AR/VR applications with moving objects. However, implementing dynamic 3DGS on edge devices faces challenges: (1) Loading all Gaussian parameters…
In this technical study, we introduce VFusedSeg3D, an innovative multi-modal fusion system created by the VisionRD team that combines camera and LiDAR data to significantly enhance the accuracy of 3D perception. VFusedSeg3D uses the rich…
A new three-dimensional (3D) multiphase computational fluid dynamics (CFD) model for adsorption physics in packed beds of spherical beads is developed and validated. The model is constituted at a macroscopic scale that integrates new…
Silicon is an excellent material for microelectronics and integrated photonics with untapped potential for mid-IR optics. Despite broad recognition of the importance of the third dimension, current lithography methods do not allow…
Encouraged by the growing availability of pre-trained 2D diffusion models, image-to-3D generation by leveraging Score Distillation Sampling (SDS) is making remarkable progress. Most existing methods combine novel-view lifting from 2D…
Depth-guided 3D reconstruction has gained popularity as a fast alternative to optimization-heavy approaches, yet existing methods still suffer from scale drift, multi-view inconsistencies, and the need for substantial refinement to achieve…
With technology scaling, the size of cache systems in chip-multiprocessors (CMPs) has been dramatically increased to efficiently store and manipulate a large amount of data in future applications and decrease the gap between cores and…
Conflating/stitching 2.5D raster digital surface models (DSM) into a large one has been a running practice in geoscience applications, however, conflating full-3D mesh models, such as those from oblique photogrammetry, is extremely…
Optical metasurfaces have been heralded as the platform to integrate multiple functionalities in a compact form-factor, potentially replacing bulky components. A central stepping stone towards realizing this promise is the demonstration of…
This study introduces a novel self-supervised learning approach for volumetric segmentation of defect indications captured by phased array ultrasonic testing data from Carbon Fiber Reinforced Polymers (CFRPs). By employing this…
Scanning superconducting quantum interference device microscopy (sSQUID) is currently one of the most effective methods for direct and sensitive magnetic flux imaging on the mesoscopic scale. A SQUID-on-chip design allows integration of…
Functional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems. Therefore, information from different physical domains has to be…
Visual-Spatial Systems has become increasingly essential in concrete crack inspection. However, existing methods often lacks adaptability to diverse scenarios, exhibits limited robustness in image-based approaches, and struggles with curved…
As designs for superconducting qubits become more complex, 3D integration of two or more vertically bonded chips will become necessary to enable increased density and connectivity. Precise control of the spacing between these chips is…
Reconstructing 3D vehicles from noisy and sparse partial point clouds is of great significance to autonomous driving. Most existing 3D reconstruction methods cannot be directly applied to this problem because they are elaborately designed…
This contribution proposes the first 3D beam-to-beam interaction model for molecular interactions between curved slender fibers undergoing large deformations. While the general model is not restricted to a specific beam formulation, in the…