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Modern computing workloads demand energy-efficient, high-bandwidth interconnects, motivating photonic interposers as an alternative to electrical links. Here we demonstrate a compact 3D silicon nitride (SiN) photonic interposer prototype…

This work presents a combined analytical and simulation-based study of a 3D-integrated quantum chip architecture. We model a flip-chip-inspired structure by stacking two superconducting qubits fabricated on separate high-resistivity silicon…

Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enables more opportunities to architect 3DICs with different die…

In medical imaging analysis, deep learning has shown promising results. We frequently rely on volumetric data to segment medical images, necessitating the use of 3D architectures, which are commended for their capacity to capture interslice…

Monolithic Three-Dimensional Integrated Circuits (M3D-IC) has become an attractive option to increase the transistor density. In M3D-IC, substrate layers are realized on top of previous layers using sequential integration techniques. Recent…

Following significant progress in the visualization and characterization of hybrid superconducting-semiconducting systems, greatly propelled by reports of Majorana zero modes in nanowire devices, considerable attention has been devoted to…

We present, SurfCuit, a novel approach to design and construction of electric circuits on the surface of 3D prints. Our surface mounting technique allows durable construction of circuits on the surface of 3D prints. SurfCuit does not…

Owing to the maturity of complementary metal oxide semiconductor (CMOS) microelectronics, qubits realized with spins in silicon quantum dots (QDs) are considered among the most promising technologies for building scalable quantum computers.…

The recent progress in chip-scale integrated photonics has stimulated the rapid development of material platforms with desired optical properties. Among the different material platforms that are currently investigated, the third-generation…

Inverse design aims to design the input variables of a physical system to optimize a specified objective function, typically formulated as a search or optimization problem. However, in 3D domains, the design space grows exponentially,…

A scalable quantum information processing architecture based on silicon metal-oxide-semiconductor technology is presented, combining quantum hardware elements from planar and 3D silicon-on-insulator technologies. This architecture is…

Future complementary metal oxide semiconductor (CMOS) scaling for advanced integrated circuit (IC) technologies may well depend on "More than Moore" (MtM) approaches using heterogeneous integration of semiconductor-based devices. In order…

This article describes the design and development of a system for remote indoor 3D monitoring using an undetermined number of Microsoft(R) Kinect sensors. In the proposed client-server system, the Kinect cameras can be connected to…

We present a fabrication process for fully superconducting interconnects compatible with superconducting qubit technology. These interconnects allow for the 3D integration of quantum circuits without introducing lossy amorphous dielectrics.…

Integrated circuits based on CMOS (complementary metal-oxide semiconductors) are at the heart of the technological revolution of the past 40 years, as these have enabled compact and low cost micro-electronic circuits and imaging systems.…

Recent progress on 2D object detection has featured Cascade RCNN, which capitalizes on a sequence of cascade detectors to progressively improve proposal quality, towards high-quality object detection. However, there has not been evidence in…

4H-silicon carbide is a promising platform for solid-state quantum technology due to its commercial availability as a wide bandgap semiconductor and ability to host numerous spin-active color centers. Integrating color centers into…

3D visual grounding allows an embodied agent to understand visual information in real-world 3D environments based on human instructions, which is crucial for embodied intelligence. Existing 3D visual grounding methods typically rely on…

Vacuum-forming is a common manufacturing technique for constructing thin plastic shell products by pressing heated plastic sheets onto a mold using atmospheric pressure. Vacuum-forming is ubiquitous in packaging and casing products in…

The field of 3D object detection from point clouds is rapidly advancing in computer vision, aiming to accurately and efficiently detect and localize objects in three-dimensional space. Current 3D detectors commonly fall short in terms of…