Related papers: Integrating MEMS and ICs
The aim of this paper is to deal with multi-physics simulation of micro-electro-mechanical systems (MEMS) based on an advanced numerical methodology. MEMS are very small devices in which electric as well as mechanical and fluid phenomena…
The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more…
Increasing AI computing demands and slowing transistor scaling have led to the advent of Multi-Chip-Module (MCMs) based accelerators. MCMs enable cost-effective scalability, higher yield, and modular reuse by partitioning large chips into…
The implementation of on-chip MEMS/NEMS transducers for arbitrary resonators is difficult due to a number of difficulties such as material choice, large dissipation, restriction in high frequency, low sensitivity, poor reliability, and poor…
Plasmonic metasurfaces enable simultaneous control of the phase, momentum, amplitude and polarisation of light and hence promise great utility in realisation of compact photonic devices. In this paper, we demonstrate a novel chip-scale…
Integrated chemical and biological sensors give advantages in cost, size and weight reduction and open new prospects for parallel monitoring and analysis. Biosensors based on nanoelectromechanical systems (NEMS) are the most attractive…
This study presents the design, fabrication, and test of a micro accelerometer with intrinsic processing capabilities, that integrates the functions of sensing and computing in the same MEMS. The device consists of an inertial mass…
Wireless networks are undergoing a transformative shift, driven by the crucial factors of cost effectiveness and sustainability. Digital coding metasurfaces (DCMs) might play a key role in realizing cost-effective digital modulators by…
A joint design of both sensing and communication can lead to substantial enhancement for both subsystems in terms of size, cost as well as spectrum and hardware efficiency. In the last decade, integrated sensing and communications (ISAC)…
A new type of microfluidic system for biological cell manipulation, a CMOS/microfluidic hybrid, is demonstrated. The hybrid system starts with a custom-designed CMOS (complementary metal-oxide semiconductor) chip fabricated in a…
Transmission Electron Microscopy (TEM) is a powerful tool for imaging material structure and characterizing material chemistry. Recent advances in data collection technology for TEM have enabled high-volume and high-resolution data…
CMOS-MEMS resonators seamlessly integrated in advanced integrated circuit (IC) technology have the unique capability to enable unprecedented integration of stable frequency references, acoustic spectral processors, and physical sensors.…
Sensors and actuators based on resonant micro-electro-mechanical systems (MEMS), such as scanning micro mirrors, are well-established in automotive and consumer products. As the areas of application broaden, the requirements for the MEMS…
In order to provide scalability to quantum information processors utilizing trapped atoms or ions as quantum bits (qubits), the capability to address multiple individual qubits in a large array is needed. Micro-electromechanical systems…
In the 21st century, biosensors have gathered much wider attention than ever before, irrespective of the technology that promises to bring them forward. With the recent COVID-19 outbreak, the concern and efforts to restore global health and…
Conventional spectrometer and polarimeter systems rely on bulky optics, fundamentally limiting compact integration and hindering multi-dimensional optical sensing capabilities. Here, we propose a spectropolarimeter enabled by…
Microelectromechanical systems (MEMS) speakers are compact, scalable alternatives to traditional voice coil speakers, promising improved sound quality through precise semiconductor manufacturing. This review provides an overview of the…
Optical metasurfaces (OMSs) have shown unprecedented capabilities for versatile wavefront manipulations at the subwavelength scale, thus opening fascinating perspectives for next generation ultracompact optical devices and systems. However,…
High-fidelity numerical methods that model the physical layout of a device are essential for the design of many technologies. For methods that characterize electromagnetic effects, these numerical methods are referred to as computational…
Low Temperature Cofired Ceramics (LTCC) has been a popular multi layer ceramic (MCM) packaging material for many electronic applications. The main advantage with LTCC would be its ability to embed a major part of the electronic circuit…