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Related papers: Interstitial diffusion of arsenic in silicon

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A two stream model of boron diffusion in silicon has been developed. The model is intended for simulation of transient enhanced diffusion including redistribution of ion-implanted boron during low temperature annealing. The following…

Materials Science · Physics 2011-05-24 O. I. Velichko , A. A. Hundorina

It has been shown that many of the phenomena related to the formation of "tails" in the low-concentration region of ion-implanted impurity distribution are due to the anomalous diffusion of nonequilibrium impurity interstitials. These…

Materials Science · Physics 2015-05-30 O. I. Velichko , A. P. Kavaliova

A model of the interstitial diffusion of ion-implanted boron during rapid thermal annealing of silicon layers previously amorphized by implantation of germanium has been proposed. It is supposed that the boron interstitials are generated…

Materials Science · Physics 2009-05-01 O. I. Velichko , N. V. Kniazhava

A model of interstitial impurity migration is proposed which explains the redistribution of ion-implanted boron in low-temperature annealing of nonamorphized silicon layers. It is supposed that nonequilibrium boron interstitials are…

Materials Science · Physics 2015-04-15 O. I. Velichko

The analytical solutions of the equations describing impurity diffusion due to migration of nonequilibrium impurity interstitials were obtained for the impurity redistribution during ion implantation at elevated temperatures and for…

Materials Science · Physics 2008-02-24 O. I. Velichko , N. A. Sobolevskaya

An analysis of the equations used for modeling thermal arsenic diffusion in silicon has been carried out. It was shown that for arsenic diffusion governed by the vacancy-impurity pairs and the pairs formed due to interaction of impurity…

Materials Science · Physics 2015-04-28 O. I. Velichko

Modeling of the long-range migration of boron interstitials during low temperature annealing of ion-implanted silicon crystals has been carried out.

Materials Science · Physics 2012-07-04 O. I. Velichko , A. P. Kavaliova

The model of transient enhanced diffusion of ion-implanted As is formulated and the finite-difference method for numerical solution of the system of equations obtained is developed. The nonuniform distribution of point defects near the…

Materials Science · Physics 2007-05-23 O. I. Velichko , A. M. Mironov , V. A. Tsurko , G. M. Zayats

It has been shown by means of impurity diffusion simulation that ion-implanted boron redistribution at the annealing temperatures 800^{\circ}C and lower is governed by the long-range migration of nonequilibrium impurity interstitials…

Materials Science · Physics 2011-06-27 O. I. Velichko , A. P. Kavaliova

A theoretical investigation of the microscopic mechanisms provided the transient enhanced diffusion of boron atoms during rapid thermal annealing of silicon substrates doped by high fluence ion implantation was carried out. To compare the…

Mesoscale and Nanoscale Physics · Physics 2010-07-23 O. I. Velichko , A. A. Hundoryna

It has been shown that during thermal treatments of silicon layers preamorphized by germanium implantation and then implanted with boron ions the transport of impurity atoms occurs right up to a temperature of 850^{\circ}C due to migration…

Materials Science · Physics 2011-06-20 O. I. Velichko , A. A. Hundorina , V. V. Axenov

Modeling of ion-implanted boron redistribution in silicon crystals during low-temperature annealing with a small thermal budget has been carried out. It was shown that formation of "tails"' in the low-concentration region of impurity…

Materials Science · Physics 2015-06-05 O. I. Velichko , A. P. Kavaliova

The diffusion path and diffusivity of oxygen in crystalline silicon are computed using an empirical interatomic potential which was recently developed for modelling the interactions between oxygen and silicon atoms. The diffusion path is…

mtrl-th · Physics 2008-02-03 Z. Jiang , R. A. Brown

We study diffusion of self-interstitial atoms (SIAs) in vanadium via molecular dynamics simulations. The <111>-split interstitials are observed to diffuse one-dimensionally at low temperature, but rotate into other <111> directions as the…

Atomistic computer simulations are applied to investigate the atomic structure, thermal stability, and diffusion processes in Al-Si interphase boundaries as a prototype of metal-ceramic interfaces in composite materials. Some of the most…

Materials Science · Physics 2023-08-24 Ian Chesser , Raj Koju , Akshay Vellore , Yuri Mishin

The thermal characteristics of silicon between 15 and 300 deg K are investigated by applying a computer program on the solution of the differential heat diffusion equation. The computer model is linked to high-purity silicon through a set…

Materials Science · Physics 2007-08-31 H. Diedrich , R. Liberati

Modeling of the phosphorus radiation-enhanced diffusion in the course of implantation of high-energy protons into an elevated-temperature silicon substrate and during its treatment in a hydrogen-containing plasma with addition of a…

Materials Science · Physics 2014-10-24 O. I. Velichko

First-principles atomistic molecular dynamics simulation in the micro-canonical and canonical ensembles has been used to study the diffusion of interstitial hydrogen in $\alpha$-iron. Hydrogen to Iron ratios between $\theta=1/16 and 1/2…

Materials Science · Physics 2011-06-03 J. Sanchez , F. Fullea , M. C. Andrade , P. L. de Andres

Atomic diffusion at nanometer length scale may differ significantly from bulk diffusion, and may sometimes even exhibit counterintuitive behavior. In the present work, taking Cu/Ni as a model system, a general phenomenon is reported which…

Materials Science · Physics 2019-05-15 Atul Tiwari , M. K. Tiwari , Mukul Gupta , H. -C. Wille , Ajay Gupta

This study explores the impact of temperature on defect dynamics in tungsten, emphasizing its application in nuclear fusion reactors as Plasma Facing Components (PFCs). Through atomistic simulations, the research elucidates the intricate…

Materials Science · Physics 2024-03-20 Yang Zhang , Jason R. Trelewicz
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