Related papers: Skybridge: 3-D Integrated Circuit Technology Alter…
The scaling barriers currently faced by both quantum networking and quantum computing technologies ultimately amount to the same core challenge of distributing high-quality entanglement at scale. In this Perspective, a novel quantum…
On the advent of the slow death of Moore's law, the silicon industry is moving towards a new era of chiplets. The automotive industry is experiencing a profound transformation towards software-defined vehicles, fueled by the surging demand…
As the gap between network and CPU speeds rapidly increases, the CPU-centric network stack proves inadequate due to excessive CPU and memory overhead. While hardware-offloaded network stacks alleviate these issues, they suffer from limited…
Circuit cutting is a promising technique that leverages both quantum and classical computational resources, enabling the practical execution of large quantum circuits on noisy intermediate-scale quantum (NISQ) hardware. Recent approaches…
In this work, we present a numerical model specifically designed for 3D multilayer devices, with a focus on nanobridge junctions and coplanar waveguides. Unlike existing numerical models, ours does not approximate the physical layout or…
Stacked intelligent metasurfaces (SIMs) have recently gained attention as a paradigm for wave-domain signal processing with reduced reliance on costly radio-frequency (RF) chains. However, conventional SIMs rely on uniform inter-layer…
Two primary challenges stand in the way of practical large-scale quantum computation, namely achieving sufficiently low error rate quantum gates and implementing interesting quantum algorithms with a physically reasonable number of qubits.…
Ion trap technologies have earned significant attention as potential candidates for quantum information processing due to their long decoherence times and precise manipulation of individual qubits, distinguishing them from other candidates…
Integrated photonics has profoundly impacted a wide range of technologies underpinning modern society. The ability to fabricate a complete optical system on a chip offers unrivalled scalability, weight, cost and power efficiency. Over the…
Split manufacturing (SM) and layout camouflaging (LC) are two promising techniques to obscure integrated circuits (ICs) from malicious entities during and after manufacturing. While both techniques enable protecting the intellectual…
Achieving high performance, energy efficiency, and cost-effectiveness while maintaining architectural flexibility is a critical challenge in the development and deployment of edge AI devices. Monolithic SoC designs struggle with this…
Qubit shuttling has become an indispensable ingredient for scaling leading quantum computing platforms, including semiconductor spin, neutral-atom, and trapped-ion qubits, enabling both crosstalk reduction and tighter integration of control…
To address the limited wave domain signal processing capabilities of traditional single-polarized stacked intelligent metasurfaces (SIMs) in holographic multiple-input multiple-output (HMIMO) systems, which stems from limited integration…
The autoregressive decoding in LLMs is the major inference bottleneck due to the memory-intensive operations and limited hardware bandwidth. 3D-stacked architecture is a promising solution with significantly improved memory bandwidth, which…
DC microgrids are converter-based electrical networks that are increasingly being used in various applications, including data centers and industrial distribution systems. A central challenge in their operation is maintaining the DC-bus…
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…
Skyrmions with topologically stable configurations have shown a promising route toward magnetic and photonic materials for information processing due to their defect-immune and low-driven energy. However, the practical application of…
On-chip optical interconnect has been widely accepted as a promising technology to realize future large-scale multiprocessors. Mode-division multiplexing (MDM) provides a new degree of freedom for optical interconnects to dramatically…
Photonic Integrated Circuits (PICs) offer transformative potential for computing systems, enabling high-bandwidth neuromorphic processors and facilitating low decoherence quantum computing on a chip scale platform. However, the development…
Interconnect is one of the main performance determinant of modern integrated circuits (ICs). The new technology of vertical ICs places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to…