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Ion traps are used for a wide range of applications from metrology to quantum simulations and quantum information processing. Microfabricated chip-based 3D ion traps are scalable to store many ions for the realization of a large number of…

Several domains of society will be disrupted once millions of high-quality qubits can be brought together to perform fault-tolerant quantum computing (FTQC). All quantum computing hardware available today is many orders of magnitude removed…

Scaling up superconducting quantum processors requires a high routing density for readout and control lines, relying on low-loss interconnects to maintain design flexibility and device performance. We propose and demonstrate a universal…

Although it is not a new concept, 3D integration increasingly receives widespread interest and focus as lithographic scaling becomes more challenging, and as the ability to make miniature vias greatly improves. Like Moores law, 3D…

Hardware Architecture · Computer Science 2025-10-21 Philip Emma , Eren Kurshan

To reduce the leakage power of inactive (dark) silicon components, modern processor systems shut-off these components' power supply using low-leakage transistors, called power-gates. Unfortunately, power-gates increase the system's…

Hardware Architecture · Computer Science 2021-12-23 Jawad Haj Yahya , Jeremie S. Kim , A. Giray Yaglikci , Jisung Park , Efraim Rotem , Yanos Sazeides , Onur Mutlu

In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…

Emerging Technologies · Computer Science 2012-01-24 Ramya Menon C. , Vinod Pangracious

Many quantum technologies require a precise electrical current standard that can only be achieved with expensive cryogenics, or through the secondary standards, such as resistance or voltage. Silicon-based charge pumps could provide such a…

While reduction in feature size makes computation cheaper in terms of latency, area, and power consumption, performance of emerging data-intensive applications is determined by data movement. These trends have introduced the concept of…

Hardware Architecture · Computer Science 2018-03-19 Bahar Asgari , Saibal Mukhopadhyay , Sudhakar Yalamanchili

We motivate a new canonical strategy for integrating photonic neural networks (NNs) by leveraging 3D printing. Our believe is that a NN's parallel and dense connectivity is not scalable without 3D integration. 3D additive fabrication…

Emerging Technologies · Computer Science 2021-03-15 Niyazi Ulas Dinc , Demetri Psaltis , Daniel Brunner

Superconducting quantum circuits are promising systems for experiments testing fundamental quantum mechanics on a macroscopic scale and for applications in quantum information processing. We report on the fabrication and characterization of…

Superconductivity · Physics 2009-01-28 T. Niemczyk , F. Deppe , M. Mariantoni , E. P. Menzel , E. Hoffmann , G. Wild , L. Eggenstein , A. Marx , R. Gross

The FFT of three-dimensional (3D) input data is an important computational kernel of numerical simulations and is widely used in High Performance Computing (HPC) codes running on a large number of processors. Performance of many scientific…

Distributed, Parallel, and Cluster Computing · Computer Science 2020-08-28 Vivek Gavane , Supriya Prabhugawankar , Shivam Garg , Archana Achalere , Rajendra Joshi

The manufacturing cost of quantum cascade lasers is still a major bottleneck for the adoption of this technology for chemical sensing. The integration of Mid-Infrared sources on Si substrate based on CMOS technology paves the way for…

Applied Physics · Physics 2019-10-22 JG Coutard , M Brun , M Fournier , O Lartigue , F Fedeli , G Maisons , JM Fedeli , S Nicoletti , M Carras , L Duraffourg

Strain engineering has played a key role in modern silicon electronics, having been introduced as a mobility booster in the 1990s and commercialized in the early 2000s. Achieving similar advances with two-dimensional (2D) semiconductors in…

The ever-increasing computation complexity of fast-growing Deep Neural Networks (DNNs) has requested new computing paradigms to overcome the memory wall in conventional Von Neumann computing architectures. The emerging Computing-In-Memory…

Hardware Architecture · Computer Science 2021-07-21 Kaining Zhou , Yangshuo He , Rui Xiao , Kejie Huang

Three-dimensional (3D) superconducting microwave cavities with large mode volumes typically have high quality factors ($>10^6$). This is due to a reduced sensitivity to surface dielectric losses, which is the limiting source of dissipation…

Quantum Physics · Physics 2016-03-25 Yarema Reshitnyk , Markus Jerger , Arkady Fedorov

Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…

Emerging Technologies · Computer Science 2012-03-09 Ramya Menon C. , Vinod Pangracious

Silicon carbide (SiC) is an important semiconductor material for fabricating power electronic devices that exhibit higher switch frequency, lower energy loss and substantial reduction both in size and weight in comparison with its Si-based…

Materials Science · Physics 2023-04-19 Guobin Wang , Da Sheng , Yunfan Yang , Hui Li , Congcong Chai , Zhenkai Xie , Wenjun Wang , Jian-gang Guo , Xiaolong Chen

Hardware specialization is commonly viewed as a way to scale performance in the dark silicon era with modern-day SoCs featuring multiple tens of dedicated accelerators. By only powering on hardware circuitry when needed, accelerators…

Hardware Architecture · Computer Science 2024-11-15 Pranav Dangi , Thilini Kaushalya Bandara , Saeideh Sheikhpour , Tulika Mitra , Lieven Eeckhout

Scalable programmable photonic integrated circuits (PICs) can potentially transform the current state of classical and quantum optical information processing. However, traditional means of programming, including thermo-optic, free carrier…

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