Related papers: A Novel Methodology for Thermal Analysis & 3-Dimen…
Intrinsic charge trap capacitive non-volatile flash memories take a significant share of the semiconductor electronics market today. It is a challenge to create intrinsic traps in the dielectric layer without high temperature processing…
Main memory (DRAM) consumes as much as half of the total system power in a computer today, resulting in a growing need to develop new DRAM architectures and systems that consume less power. Researchers have long relied on DRAM power models…
The temperature ($T$)-shift protcol of aging in the 3 dimensional (3D) Edwards- Anderson (EA) spin-glass (SG) model is studied through the out-of-phase component of the ac susceptibility simulated by the Monte Carlo method. For processes…
As integrated circuits continue to scale down and adopt three-dimensional (3D) stacking, thermal management in the back-end-of-line (BEOL) has emerged as a critical design constraint. In this study, we present a combined experimental and…
Neuromorphic or neurally-inspired optimizers rely on local but parallel parameter updates to solve problems that range from quadratic programming to Ising machines. An ideal realization of such an optimizer not only uses a compute-in-memory…
Interconnect is one of the main performance determinant of modern integrated circuits (ICs). The new technology of vertical ICs places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to…
While Moore's Law has approached its physical limits lately, the high integration and miniaturisation of electronics have also brought another thermal failure obstacle. Previous studies on single-phase flow demanded significant pump power…
Thermal analysis is increasingly critical in modern integrated circuits, where non-uniform power dissipation and high transistor densities can cause rapid temperature spikes and reliability concerns. Traditional methods, such as FEM-based…
Energy costs of information processing are growing exponentially. Bit erasure is a key problem in this energy-information nexus, and a number of seminal relationships have been deduced regarding the relationship between thermodynamic costs…
Compared to planar (i.e., two-dimensional) NAND flash memory, 3D NAND flash memory uses a new flash cell design, and vertically stacks dozens of silicon layers in a single chip. This allows 3D NAND flash memory to increase storage density…
Practical implementations of quantum technologies require preparation of states with a high degree of purity---or, in thermodynamic terms, very low temperatures. Given finite resources, the Third Law of thermodynamics prohibits perfect…
To overcome the well-known memory bottleneck of AI chips, 3D stacked architectures that employ advanced packaging technology with high-density through-silicon vias (TSVs) pins have proven to be a promising solution. The 3D-stacked AI chip…
Researchers and designers are facing problems with memory and power walls, considering the pervasiveness of Von-Neumann architecture in the design of processors and the problems caused by reducing the dimensions of deep sub-micron…
When a spin glass is cooled down, a memory of the cooling process is imprinted in the spin structure. This memory can be disclosed in a continuous heating measurement of the ac-susceptibility. E.g., if a continuous cooling process is…
The recent Natural Language Processing techniques have been refreshing the state-of-the-art performance at an incredible speed. Training huge language models is therefore an imperative demand in both industry and academy. However, huge…
We measured the energy efficiency of information erasure using silicon DRAM cells capable of counting charges on capacitors at the single-electron level. Our measurements revealed that the efficiency decreased as the erasure error…
Emerging high-performance storage technologies are opening up the possibility of designing new distributed data acquisition system architectures, in which the live acquisition of data and their processing are decoupled through a storage…
The conventional approach of moving data to the CPU for computation has become a significant performance bottleneck for emerging scale-out data-intensive applications due to their limited data reuse. At the same time, the advancement in 3D…
Scalable persistent memory (PM) has opened up new opportunities for building indexes that operate and persist data directly on the memory bus, potentially enabling instant recovery, low latency and high throughput. When real PM hardware…
Dissipative particle dynamics (DPD) does not conserve energy and this precludes its use in the study of thermal processes in complex fluids. We present here a generalization of DPD that incorporates an internal energy and a temperature…