Related papers: A Novel Methodology for Thermal Analysis & 3-Dimen…
This project introduces a groundbreaking approach to address the challenge of periodic signal compression. By proposing a novel adaptive coding method, coupled with hardware-assisted data compression, we have developed a new architecture…
We discuss and review several thermodynamic criteria that have been introduced to characterize the thermal stability of a self-correcting quantum memory. We first examine the use of symmetry-breaking fields in analyzing the properties of…
CMOS VLSI technology is the most dominant integration methodology prevailing in the world today. Various signal-processing blocks are made using analog or digital design techniques in MOS VLSI. An important component is the Memory unit used…
Various side-channel attacks (SCAs) on ICs have been successfully demonstrated and also mitigated to some degree. In the context of 3D ICs, however, prior art has mainly focused on efficient implementations of classical SCA countermeasures.…
To accommodate the growing memory footprints of today's applications, CPU vendors have employed large DRAM caches, backed by large non-volatile memories like Intel Optane (e.g., Intel's Cascade Lake). The existing computer architecture…
Classical computing is beginning to encounter fundamental limits of energy efficiency. This presents a challenge that can no longer be solved by strategies such as increasing circuit density or refining standard semiconductor processes. The…
We study the dynamical correlation functions and heat conduction for the simplest model of quasi one-dimensional (1d) dielectric crystal i.e. a chain of classical particles coupled by quadratic and cubic intersite potential. Even in the…
Advances in nanosheet technologies have significantly increased power densities, exacerbating thermal management challenges in 2.5D/3D chiplet-based Systems-in-Package (SiP). While traditional thermal analyses often employ uniform power…
In this paper we report on a novel simulation tool designed for the 3D coupled electro-thermal simulation of Smart Power Mosfets, that is a tool capable of taking into account not only the electrical (and thermal) behaviour of the power…
After nearly a decade of anticipation, scalable nonvolatile memory DIMMs are finally commercially available with the release of Intel's 3D XPoint DIMM. This new nonvolatile DIMM supports byte-granularity accesses with access times on the…
A programmable linear resistor with a compact footprint would have profound implications for microelectronics, enabling efficient in-sensor analog signal processing and in-memory computing. Non-volatile memory offers a potential solution…
Framing computation as the transformation of metastable memories, we explore its fundamental thermodynamic limits. The true power of information follows from a novel decomposition of nonequilibrium free energy derived here, which provides a…
This study compares different methods to predict the simultaneous effects of conductive and radiative heat transfer in a Polymethylmethacrylate (PMMA) sample. PMMA is a kind of polymer utilized in various sensors and actuator devices.…
To improve transistor density and electronic performance, next-generation semiconductor devices are adopting three-dimensional architectures and feature sizes down to the few-nm regime, which require atomic-scale metrology to identify and…
Polymer 3D-printing has been commercialized rapidly during recent years, however, there remains a matter of improving the manufacturing speed. Screw extrusion has a strong potential to fasten the process through simultaneous operation of…
Matrix-accelerated stencil computation is a hot research topic, yet its application to three-dimensional (3D) high-order stencils and HPC remains underexplored. With the emergence of matrix units on multicore CPUs, we analyze matrix-based…
GPUs have become indispensable in high-performance computing, machine learning, and many other domains. Efficiently utilizing the memory subsystem on GPUs is critical for maximizing computing power through massive parallelism. Analyzing…
With the help of quantum mechanics one can formulate a model of associative memory with optimal storage capacity. I generalize this model by introducing a parameter playing the role of an effective temperature. The corresponding…
This paper addresses the challenge of reconstructing a 3D power spectrum map from sparse, scattered, and incomplete spectrum measurements. It proposes an integrated approach combining interpolation and block-term tensor decomposition (BTD).…
We present a new approach for the two-temperature molecular dynamics (MD) model for coupled simulations of electronic and phonon heat conduction in nanoscale systems. The proposed method uses a master equation to perform heat conduction of…