Related papers: A Novel Methodology for Thermal Analysis & 3-Dimen…
This paper presents a unified optimization framework for phase change material (PCM) based cooling systems. Thermal management is critical in applications such as photovoltaic (PV) modules, battery packs, and power electronics, where…
The massive amounts of data generated by camera sensors motivate data processing inside pixel arrays, i.e., at the extreme-edge. Several critical developments have fueled recent interest in the processing-in-pixel-in-memory paradigm for a…
While Moore's law has driven exponential computing power expectations, its nearing end calls for new avenues for improving the overall system performance. One of these avenues is the exploration of alternative brain-inspired computing…
In this work we have proposed a geometric model that is employed to devise a scheme for identifying the hotspots and zones in a chip. These spots or zone need to be guarded thermally to ensure performance and reliability of the chip. The…
In-memory computing is a promising alternative to traditional computer designs, as it helps overcome performance limits caused by the separation of memory and processing units. However, many current approaches struggle with unreliable…
Our ISCA 2013 paper provides a fundamental empirical understanding of two major factors that make it very difficult to determine the minimum data retention time of a DRAM cell, based on the first comprehensive experimental characterization…
We discuss the influence of atomic thermal motion on the efficiency of multimode quantum memory in two configurations: over the free expand of atoms cooled beforehand in a magneto-optical trap, and over complete mixing of atoms in a closed…
Due to embedded systems` stringent design constraints, much prior work focused on optimizing energy consumption and/or performance. Since embedded systems typically have fewer cooling options, rising temperature, and thus temperature…
We have studied the role of thermalization in lifetime reduction of quantum memory based on multi-atomic ensembles. Herein, it is shown to be impossible to remove the thermaization-caused decoherence in such systems using the methods of…
The Intel Optane DC Persistent Memory (DCPM) is an attractive novel technology for building storage systems for data intensive HPC applications, as it provides lower cost per byte, low standby power and larger capacities than DRAM, with…
We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it…
We introduce and experimentally validate a new macro-level model of the CPU temperature/power relationship within nanometer-scale application processors or system-on-chips. By adopting a holistic view, this model is able to take into…
The effect of melting in planetary mantles plays a key role in their thermo-chemical evolution. Because of the laterally heterogeneous nature of melting, 3D numerical simulations are in principle necessary prohibiting us from exploring wide…
Phase change material based thermal energy storage has many current and potential applications in the heating and cooling of buildings, battery and electronics thermal management, thermal textiles, and dry cooling of power plants. However,…
Thermal aware routing and placement algorithms are important in industry. Currently, there are reasonably fast Green's function based algorithms that calculate the temperature distribution in a chip made from a stack of different materials.…
Thermoelectric energy conversion is an attractive technology for generating electricity from waste heat and using electricity for solid-state cooling. However, conventional manufacturing processes for thermoelectric devices are costly and…
The current mobile applications have rapidly growing memory footprints, posing a great challenge for memory system design. Insufficient DRAM main memory will incur frequent data swaps between memory and storage, a process that hurts…
Next-generation supercomputers will feature more hierarchical and heterogeneous memory systems with different memory technologies working side-by-side. A critical question is whether at large scale existing HPC applications and emerging…
One of the crucial steps in the design of an integrated circuit is the minimization of heating and temperature non-uniformity. Current temperature calculation methods, such as finite element analysis and resistor networks have considerable…
Monolithic 3D (M3D) technology enables high density integration, performance, and energy-efficiency by sequentially stacking tiers on top of each other. M3D-based network-on-chip (NoC) architectures can exploit these benefits by adopting…