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Neural 3D implicit representations learn priors that are useful for diverse applications, such as single- or multiple-view 3D reconstruction. A major downside of existing approaches while rendering an image is that they require evaluating…
Three-dimensional electron diffraction (3DED) is a powerful technique providing for crystal structure solutions of sub-micron sized crystals too small for structure determination via X-ray techniques. The entry requirement, however, of a…
We describe and evaluate a new instrument design called a Tunable Echelle Imager (TEI). In this instrument, the output from an imaging Fabry-Perot interferometer is cross-dispersed by a grism in one direction and dispersed by an echelle…
Using cryogenic transmission electron microscopy, we revealed three dimensional (3D) structural details of the electrochemically plated lithium (Li) flakes and their solid electrolyte interphase (SEI), including the composite SEI skin-layer…
Diffusion-weighted imaging (DWI) is a powerful non-invasive tool which is widely used in clinical routine. Mostly, apparent diffusion coefficient maps are acquired, which cannot be directly related to cellular structure. More recently it…
The rapid progress in 6G communication and high-bandwidth radar has driven an unprecedented surge in the spatial density of signal sources, resulting in an increasingly congested electromagnetic (EM) environment. When resolving closely…
Machine learning algorithms have enabled high quality stereo depth estimation to run on Augmented and Virtual Reality (AR/VR) devices. However, high energy consumption across the full image processing stack prevents stereo depth algorithms…
Monolithic Three-Dimensional Integrated Circuits (M3D-IC) has become an attractive option to increase the transistor density. In M3D-IC, substrate layers are realized on top of previous layers using sequential integration techniques. Recent…
The concept of the deep trapping gate device was introduced fairly recently on the basis of technological and transport simulations currently used in the field of classical electron devices. The concept of a buried gate containing localized…
This study aims to relate the time-frequency patterns of acoustic emission (AE) and other multi-modal sensor data collected in a hybrid directed energy deposition (DED) process to the pore formations at high spatial (0.5 mm) and time (<…
Polyetheretherketone (PEEK), as a semi-crystalline high-performance engineering plastic, has demonstrated good application prospects since its introduction. The ability of PEEK to be fabricated in complex architecture is a major limitation…
Recently-demonstrated high-quality three-dimensional (3D) subsurface laser processing inside crystalline silicon (c-Si) wafers opens a door to a wide range of novel applications in multidisciplinary research areas. Using this technique, a…
Additive manufacturing (AM) allows for manufacturing of complex three-dimensional geometries not typically realizable with standard subtractive manufacturing practices. The internal microstructure of a 3D printed component can have a…
Reconfigurable Intelligent Surface (RIS) or metasurface is one of the important enabling technologies in mobile cellular networks that can effectively enhance the signal coverage performance in obstructed regions, and it is generally…
The technology of Reconfigurable Intelligent Surfaces (RISs) is lately being considered as a boosting component for various indoor wireless applications, enabling wave propagation control and coverage extension. However, the incorporation…
3D die-stacked DRAM has emerged as a key technology for delivering high bandwidth and high density for applications such as high-performance computing, graphics, and machine learning. However, different applications place diverse and…
Silicon Carbide (SiC) is an outstanding material, not only for electronic applications, but also for projected functionalities in the realm of photonic quantum technologies, nano-mechanical resonators and photonics on-a-chip. For shaping 3D…
Sampling discrepancies between different manufacturers and models of lidar sensors result in inconsistent representations of objects. This leads to performance degradation when 3D detectors trained for one lidar are tested on other types of…
The most direct definition of a patterning process' resolution is the smallest half-pitch feature it is capable of transferring onto the substrate. Here we demonstrate that thermal Scanning Probe Lithography (t-SPL) is capable of…
Producing interactive 3D printed objects currently requires laborious 3D design and post-instrumentation with off-the-shelf electronics. Multi-material 3D printing using conductive PLA presents opportunities to mitigate these challenges. We…