Related papers: Fabrication of 3D Packaging TSV using DRIE
Users can improve the security of remote communications by using Trusted Execution Environments (TEEs) to protect against direct introspection and tampering of sensitive data. This can even be done with applications coded in high-level…
While generative artificial intelligence has advanced significantly across text, image, audio, and video domains, 3D generation remains comparatively underdeveloped due to fundamental challenges such as data scarcity, algorithmic…
A new type of integrated polarizer based on bent coupled optical waveguides is proposed. The simplicity of the device geometry permits its realization using only basic standard fabrication steps. A deep etched waveguide silicon nitride…
We report a direct, maskless electron beam-induced etching (EBIE) process for diamond in air, enabling high-precision patterning without lithography or plasma processing. Through a comprehensive analysis of electron-gas, electron-diamond,…
This paper presents the concept of an ultra-stable, thermally independent precision voltage divider tailored for direct current (DC) voltages up to 60 kV. Key features of this voltage divider include minimal voltage dependence, excellent…
The Diffusion Transformer (DiT) architecture is the state-of-the-art paradigm for high-fidelity image generation, underpinning models like Stable Diffusion-3 and FLUX.1. However, deploying these models on resource-constrained mobile devices…
Focused ion beams (FIBs) are widely used in nanofabrication for applications such as circuit repair, ultra-thin lamella preparation, strain engineering, and quantum device prototyping. Although the lateral spread of the ion beam is often…
The 3D silicon sensor has demonstrated excellent performances (signal collection, detection efficiency, power consumption, etc.) comparable or even better with respect to the traditional planar sensor of the ATLAS Detector at the Large…
Generating high-quality 3D assets from text and images has long been challenging, primarily due to the absence of scalable 3D representations capable of capturing intricate geometry distributions. In this work, we introduce Direct3D, a…
Open RAN introduces a flexible, cloud-based architecture for the Radio Access Network (RAN), enabling Artificial Intelligence (AI)/Machine Learning (ML)-driven automation across heterogeneous, multi-vendor deployments. While EXplainable…
Written by its inventors, this first tutorial on Beyond-Diagonal Reconfigurable Intelligent Surfaces (BD-RISs) provides the readers with the basics and fundamental tools necessary to appreciate, understand, and contribute to this emerging…
The ongoing demand for more energy-efficient, high-performance electronics is driving the exploration of innovative materials and device architectures, where interfaces play a crucial role due to the continuous downscaling of device…
With the breakthroughs in Deep Learning, recent years have witnessed a massive surge in Artificial Intelligence applications and services. Meanwhile, the rapid advances in Mobile Computing and Internet of Things has also given rise to…
Reconfigurable intelligent surface (RIS) is considered as an extraordinarily promising technology to solve the blockage problem of millimeter wave (mmWave) communications owing to its capable of establishing a reconfigurable wireless…
In this study, we fabricate 5-30-nm-thick films of FeSe/STO using pulsed laser deposition (PLD). The grown films exhibit superconductivity with an onset $T_{\mathrm{c}}$ that is much higher than that of bulk FeSe under ambient pressure. The…
t-distributed stochastic neighbor embedding (t-SNE) is a well-established visualization method for complex high-dimensional data. However, the original t-SNE method is nonparametric, stochastic, and often cannot well prevserve the global…
Reconfigurable intelligent surfaces (RISs) allow controlling the propagation environment in wireless networks through reconfigurable elements. Recently, beyond diagonal RISs (BD-RISs) have been proposed as novel RIS architectures whose…
The purpose of this project is to investigate the use of charge couple devices (CCDs) to detect electrons directly. This can be done in transmission electron microscopy (TEM) for electrons over 100 KeV, but for space plasma instruments,…
Reconfigurable Intelligent Surfaces (RISs) are a novel form of ultra-low power devices that are capable to increase the communication data rates as well as the cell coverage in a cost- and energy-efficient way. This is attributed to their…
Millions of sensors, cameras, meters, and other edge devices are deployed in networks to collect and analyse data. In many cases, such devices are powered only by Energy Harvesting(EH) and have limited energy available to analyse acquired…