Related papers: Fabrication of 3D Packaging TSV using DRIE
We developed CdTe double-sided strip detectors (DSDs or cross strip detectors) and evaluated their spectral and imaging performance for hard X-rays and gamma-rays. Though the double-sided strip configuration is suitable for imagers with a…
A thick electrode with high areal capacity has been developed as a strategy for high-energy-density lithium-ion batteries, but thick electrodes have difficulties in manufacturing and limitations in ion transport. Here, we reported a new…
A digital etching method was proposed to achieve excellent control of etching depth. The digital etching characteristics of p+ Si and Si0.7Ge0.3 using the combinations of HNO3 oxidation and BOE oxide removal processes were studied.…
Large-scale three-dimensional (3D) scene reconstruction in low-altitude intelligent networks (LAIN) demands highly efficient wireless image transmission. However, existing schemes struggle to balance severe pilot overhead with the…
Understanding the mechanical interplay between silicon anodes and their surrounding solid-electrolyte interphase (SEI) is essential to improve the next generation of lithium-ion batteries. We model and simulate a 2D elliptical silicon…
With the growth of sensing, control and robotic technologies, autonomous underwater vehicles (AUVs) have become useful assistants to human divers for performing various underwater operations. In the current practice, the divers are required…
We introduce TetWeave, a novel isosurface representation for gradient-based mesh optimization that jointly optimizes the placement of a tetrahedral grid used for Marching Tetrahedra and a novel directional signed distance at each point.…
Four-dimensional Scanning Transmission Electron Microscopy (4D-STEM) is a powerful technique for high-resolution and high-precision materials characterization at multiple length scales, including the characterization of beam-sensitive…
We propose TC-AE, a ViT-based architecture for deep compression autoencoders. Existing methods commonly increase the channel number of latent representations to maintain reconstruction quality under high compression ratios. However, this…
The direct bonding process of a diamond-on-insulator (DOI) substrate enables monolithic integration of diamond photonic structures for quantum computing by improving photon collection efficiency and entanglement generation rate between…
Precise control of ion energy distribution functions (IEDF) is crucial for selectivity as well as control over sputter rate and substrate damage in nanoscale plasma processes. In this work, a low frequency (100 kHz) tailored…
RISC-V processors encounter substantial challenges in deploying multi-precision deep neural networks (DNNs) due to their restricted precision support, constrained throughput, and suboptimal dataflow design. To tackle these challenges, a…
We present a ray-tracing technique for radiative transfer modeling of complex three-dimensional (3D) structures which include dense regions of high optical depth like in dense molecular clouds, circumstellar disks, envelopes of evolved…
In three dimensional integrated circuits (3D-ICs), through silicon via (TSV) is a critical technique in providing vertical connections. However, the yield and reliability is one of the key obstacles to adopt the TSV based 3D-ICs technology…
The fabrication of micro- and nano-scale silicon electronic devices requires precision lithography and controlled processing to ensure that the electronic properties of the device are optimized. Importantly, the Si-SiO2 interface plays a…
The Multimodal Direct Inversion (MMDI) algorithm is widely used in Magnetic Resonance Elastography (MRE) to estimate tissue shear stiffness. However, MMDI relies on the Helmholtz equation, which assumes wave propagation in a uniform,…
Coherent diffractive imaging (CDI) enables lensless imaging with experimental simplicity and a flexible field of view, yet its resolution is fundamentally constrained by the Abbe diffraction limit. To overcome this limitation, we introduce…
Micro-transfer printing is an assembly technology that enables large-scale integration of diverse materials and components from micro- to nano-scale. However, traditional micro-transfer printing technologies lack dynamic selectivity,…
High-quality whole-slide scanning is expensive, complex, and time-consuming, thus limiting the acquisition and utilization of high-resolution histopathology images in daily clinical work. Deep learning-based single-image super-resolution…
Extreme ultraviolet (EUV) lithography is the leading lithography technique in CMOS mass production, moving towards the sub-10 nm half-pitch (HP) regime with the ongoing development of the next generation high-numerical aperture (high-NA)…