Related papers: Fabrication of 3D Packaging TSV using DRIE
Real-world image super-resolution (Real-ISR) focuses on recovering high-quality images from low-resolution inputs that suffer from complex degradations like noise, blur, and compression. Recently, diffusion models (DMs) have shown great…
The deployment of Deep Neural Networks (DNNs) on end-nodes at the extreme edge of the Internet-of-Things is a critical enabler to support pervasive Deep Learning-enhanced applications. Low-Cost MCU-based end-nodes have limited on-chip…
State-of-the-art deep neural networks (DNNs) have hundreds of millions of connections and are both computationally and memory intensive, making them difficult to deploy on embedded systems with limited hardware resources and power budgets.…
The evolution of quantization and mixed-precision techniques has unlocked new possibilities for enhancing the speed and energy efficiency of NNs. Several recent studies indicate that adapting precision levels across different parameters can…
The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-scale VLSI systems with higher energy efficiency in data…
The design and fabrication of low-loss wide-bandwidth superconducting vacuum-gap crossovers for high performance millimeter wave applications are described. In order to reduce ohmic and parasitic losses at millimeter wavelengths a vacuum…
Diffusion models have attained remarkable breakthroughs in the real-world super-resolution (SR) task, albeit at slow inference and high demand on devices. To accelerate inference, recent works like GenDR adopt step distillation to minimize…
Recent 3D content generation pipelines commonly employ Variational Autoencoders (VAEs) to encode shapes into compact latent representations for diffusion-based generation. However, the widely adopted uniform point sampling strategy in Shape…
Additive manufacturing is an expanding multidisciplinary field encompassing applications including medical devices, aerospace components, microfabrication strategies, and artificial organs. Among additive manufacturing approaches,…
Electrical Impedance Tomography (EIT) is a powerful imaging technique with diverse applications, e.g., medical diagnosis, industrial monitoring, and environmental studies. The EIT inverse problem is about inferring the internal conductivity…
We present Deep Compression Autoencoder (DC-AE), a new family of autoencoder models for accelerating high-resolution diffusion models. Existing autoencoder models have demonstrated impressive results at a moderate spatial compression ratio…
Dynamic operating envelopes (DOEs) offer an attractive solution for maintaining network integrity amidst increasing penetration of distributed energy resources (DERs) in low-voltage (LV) networks. Currently, the focus of DOEs primarily…
Conical nanopores in amorphous SiO$_{2}$ thin films fabricated using the ion track etching technique show promising potential for filtration, sensing and nanofluidic applications. The characterization of the pore morphology and size…
Radiative transfer (RT) modelling is a necessary tool in the interpretation of observations of the thermal emission of interstellar dust. It is also often part of multi-physics modelling. In this context, the efficiency of radiative…
A dramatic influx of diffusion-generated images has marked recent years, posing unique challenges to current detection technologies. While the task of identifying these images falls under binary classification, a seemingly straightforward…
High energy dual-energy X-ray Digital Radiography(DR) imaging is mainly used in material recognition of the cargo inspection. We introduce the development history and the principle of the technology and describe the data process flow of our…
High fidelity representation of shapes with arbitrary topology is an important problem for a variety of vision and graphics applications. Owing to their limited resolution, classical discrete shape representations using point clouds, voxels…
Surface integral equation (SIE) methods are of great interest for the efficient electromagnetic modeling of various devices, from integrated circuits to antenna arrays. Existing acceleration algorithms for SIEs, such as the adaptive…
We present a formalism for understanding the elecromagnetism of metasurfaces, optically thin composite films with engineered diffraction. The technique, diffractive interface theory (DIT), takes explicit advantage of the small optical…
Reconfigurable intelligent surface (RIS) is a new and revolutionary technology to achieve spectrum-, energy- and cost-efficient wireless networks. This paper studies the resource allocation for RIS-empowered device-to-device (D2D)…