Related papers: Fabrication of 3D Packaging TSV using DRIE
We introduce a method for finely adjusting the etch depth profile by dynamic shielding in the course of ion beam etching (IBE), which is crucial for the ultra-precision fabrication of large optics. We study the physical process of dynamic…
Diffractive optical elements (DOEs) have a wide range of applications in optics and photonics, thanks to their capability to perform complex wavefront shaping in a compact form. However, widespread applicability of DOEs is still limited,…
As energy efficiency became a critical factor in the embedded systems domain, dynamic voltage and frequency scaling (DVFS) techniques have emerged as means to control the system's power and energy efficiency. Additionally, due to the…
In the construction of High-Luminosity Large Hadron Collider (HL-LHC) and Future Circular Collider (FCC) experiments, 3D pixel sensors have become indispensable components due to their superior radiation hardness, fast response, and low…
Pulsed-laser dry printing of noble-metal microrings with a tunable internal porous structure, which can be revealed via an ion-beam etching post-procedure, was demonstrated. Abundance and average size of the pores inside the microrings were…
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
Nanoscale control of optical dispersion is essential for applications ranging from miniaturized spectrometers to color printing, all of which demand broadband spectral tunability. However, the Kramers-Kronig relations impose a fundamental…
In this study, we report the first Cu-filled through silicon via (TSV) integrated ion trap. TSVs are placed directly underneath electrodes as vertical interconnections between ion trap and a glass interposer, facilitating the arbitrary…
Scaling trapped-ion quantum computing will require robust trapping of at least hundreds of ions over long periods, while increasing the complexity and functionality of the trap itself. Symmetric 3D structures enable high trap depth, but…
Diffusion models are widely recognized for their ability to generate high-fidelity images. Despite the excellent performance and scalability of the Diffusion Transformer (DiT) architecture, it applies fixed compression across different…
We developed a 2-mm-thick CdTe double-sided strip detector (CdTe-DSD) with a 250 um strip pitch, which has high spatial resolution with a uniform large imaging area of 10 cm$^2$ and high energy resolution with high detection efficiency in…
Recent advances in neural scene representations have transformed immersive multimedia, with 3D Gaussian Splatting (3DGS) enabling real-time photorealistic rendering. Despite its efficiency, 3DGS suffers from large memory requirements and…
We present a tomographic imaging technique, termed Deep Prior Diffraction Tomography (DP-DT), to reconstruct the 3D refractive index (RI) of thick biological samples at high resolution from a sequence of low-resolution images collected…
The deep trapping gate pixel device was described recently as an alternative to CMOS 3T pixel. The feasibilty of this device was studied with technological and transport simulations used in classical electron devices and process design. A…
Due to its exceptional dimensional stability in harsh thermal conditions and excellent mechanical and optical properties, Corning ultra-low expansion (ULE) glass is the material of choice in many high-demanding fields such as aerospace,…
Diffusion MRI (dMRI) is a unique imaging technique for in vivo characterization of tissue microstructure and white matter pathways. However, its relatively long acquisition time implies greater motion artifacts when imaging, for example,…
A reliable and scalable transfer of 2D-TMDCs (two-dimensional transition metal dichalcogenides) from the growth substrate to a target substrate with high reproducibility and yield is a crucial step for device integration. In this work, we…
Increasing power densities in integrated circuits has led to an increased prevalence of thermal hotspots in integrated circuits. Tracking these thermal hotspots is imperative to prevent circuit failures. In 3D integrated circuits,…
3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal…