Related papers: Fabrication of 3D Packaging TSV using DRIE
High-index dielectric metasurfaces featuring Mie-type electric and magnetic resonances have been of a great interest in a variety of applications such as imaging, sensing, photovoltaics and others, which led to the necessity of an efficient…
Trapped-ion applications, such as in quantum information, precision measurements, optical clocks, and mass spectrometry, rely on specialized high-performance ion traps. The latter applications typically employ traditional machining to…
The ray-tracing is often employed in urban areas for channel modeling with high accuracy but encounters a substantial computational complexity for high mobility scenarios. In this paper, we propose a novel pre-processing method for dynamic…
In two-photon polymerization (TPP), the degree of conversion (DC) of the resin has an effect on a broad range of material properties like refractive index (RI) or stiffness. Heterogeneous DC can substitute material doping and multimaterial…
Reconfigurable intelligent surfaces (RIS) have recently received significant attention as building blocks for smart radio environments and adaptable wireless channels. By altering the space- and time-varying electromagnetic (EM) properties,…
In line with the AI-native 6G vision, explainability and robustness are crucial for building trust and ensuring reliable performance in millimeter-wave (mmWave) systems. Efficient beam alignment is essential for initial access, but deep…
Speckle patterns in ultrasound images often obscure anatomical details, leading to diagnostic uncertainty. Recently, various deep learning (DL)-based techniques have been introduced to effectively suppress speckle; however, their high…
Ternary Deep Neural Networks (DNN) have shown a large potential for highly energy-constrained systems by virtue of their low power operation (due to ultra-low precision) with only a mild degradation in accuracy. To enable an…
Recycled aluminum alloys are pivotal for sustainable manufacturing, offering strength, durability, and environmental advantages. However, the presence of iron (Fe) impurities poses a major challenge, undermining their properties and…
Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain multiple materials with non-linear heat transfer properties…
Reconfigurable Intelligent Surfaces (RISs) offer a promising means of reshaping the wireless propagation environment, yet practical methods for configuring large passive arrays to achieve reliable signal equalization remain limited.…
Porous silicon (p-Si), prepared by two routes (metal induced etching (MIE) and laser induced etching (LIE)) have been studied by comparing the observed surface morphologies using SEM. A uniformly distributed smaller (submicron sized) pores…
To improve transistor density and electronic performance, next-generation semiconductor devices are adopting three-dimensional architectures and feature sizes down to the few-nm regime, which require atomic-scale metrology to identify and…
Non-linear detection schemes can substantially improve the achievable throughput and connectivity capabilities of uplink MU-MIMO systems that employ linear detection. However, the complexity requirements of existing non-linear soft…
In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the dual-sided Monolithic 3D (M3D). Based on…
Mid-infrared spectroscopy enables biochemical sensing by identifying vibrational molecular fingerprints, but it faces limitations in instrumentation portability and analytical sensitivity. Optical metasurfaces with strong mid-IR photonic…
The height of dielectric metasurfaces is largely considered a constant in the fabrication process due to the top-down fabrication approach, resulting in a binary structure. Yet, for the recently introduced Mie voids metasurfaces,…
Transfer techniques based on two dimensional (2D) materials and devices offer immense potential towards their industrial integration with the existing silicon based electronics. To achieve high quality devices, there is an urgent…
Purpose: To develop and evaluate a new pulse sequence for highly accelerated distortion-free diffusion MRI (dMRI) by inserting additional echoes without prolonging TR, when generalized slice dithered enhanced resolution (gSlider)…
Reconfigurable intelligent surfaces (RISs) are envisioned to play a key role in future wireless communication networks. However, channel estimation in RIS-aided wireless networks is challenging due to their passive nature and the large…