Related papers: Thermal measurement and modeling of multi-die pack…
A multiphysics modeling approach for heat conduction in metal hydride powders is presented, including particle shape distribution, size distribution, granular packing structure, and effective thermal conductivity. A statistical geometric…
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…
Accurate knowledge of mechanical and thermal properties of structural materials used in MEMS is essential for optimum geometric and functional design. The extraction of precise physical properties is rather complicated due to the size…
We investigate the radiative heat transfer and spatial distributions of stationary temperatures in periodic many-body systems composed of alternating slabs of two different materials. We show that temperature distributions exhibit an…
We present results of a Monte Carlo study of temperature-programmed desorption in a model system with attractive lateral interactions. It is shown that even for weak interactions there are large shifts of the peak maximum temperatures with…
Conformal mapping is an important mathematical tool in many physical and engineering fields, especially in electrostatics, fluid mechanics, classical mechanics, and transformation optics. However in the existing textbooks and literatures,…
Lithium-ion batteries are widely used in electric vehicles and grid energy storage systems. Compared to cylindrical batteries, prismatic cells are the primary choice because of their advantage for dense packing. However, thermal runaway and…
Cooling of particles to mK-temperatures is essential for a variety of experiments with trapped charged particles. However, many species of interest lack suitable electronic transitions for direct laser cooling. We study theoretically the…
Active thermal control is crucial in achieving the required accuracy and throughput in many industrial applications, e.g., in the medical industry, high-power lighting industry, and semiconductor industry. Thermoelectric Modules (TEMs) can…
Accelerated cooling is a key technology in producing thermomechanically controlled processed (TMCP) steel plates. In a TMCP process hot plates are subjected to a strong cooling what results in a complex microstructure leading to increased…
We study the differential equations of lumped-parameter models of spacecraft thermal control. Firstly, we consider a satellite model consisting of two isothermal parts (nodes): an outer part that absorbs heat from the environment as…
This paper studies the design and dynamic modelling of a novel thermal energy storage (TES) system combined with a refrigeration system based on phase change materials (PCM). Cold-energy production supported by TES systems is a very…
We present an experimental unit that realizes the ``multi-input, multi-output manifold'' thermal management technology proposed by Lamarre & Raymond (2023). The proposed setup can be used for experiments aimed at controlling spatiotemporal…
CMB-S4 is the fourth-generation ground-based cosmic microwave background project, designed to probe the early universe and cosmic inflation. CMB-S4 would achieve its science goals in part by dramatically increasing the number of transition…
In this thesis I present most of the results obtained during my PhD, where I worked on different subjects regarding jamming in systems of frictionless spheres. In particular, I focused on microscopic properties of jammed packings, such as…
We construct a collision model description of the thermalization of a finite many-body system by using careful derivation of the corresponding Lindblad-type master equation in the weak coupling regime. Using the example of two level target…
Accurate on-chip temperature sensing is critical for the optimal performance of modern CMOS integrated circuits (ICs), to understand and monitor localized heating around the chip during operation. The development of quantum computers has…
The stability of Al-Mn transition edge sensor (TES) bolometers is studied as we vary the engineered TES transition, heat capacity, and/or coupling between the heat capacity and TES. We present thermal structure measurements of each of the…
Microfabricated ion-trap devices offer a promising pathway towards scalable quantum computing. Research efforts have begun to focus on the engineering challenges associated with developing large-scale ion-trap arrays and networks. However,…
We have designed and developed a new experimental setup, based on the 3-omega method, to measure thermal conductivity, heat capacity and electrical resistivity of a variety of samples in a broad temperature range (2-550 K) and under…