Related papers: Thermal measurement and modeling of multi-die pack…
We demonstrate the measurement and manipulation of the temperature of cold CO molecules in a microchip environment. Through the use of time-resolved spatial imaging, we are able to observe the phase-space distribution of the molecules, and…
The operation of resistive and phase-change memory (RRAM and PCM) is controlled by highly localized self-heating effects, yet detailed studies of their temperature are rare due to challenges of nanoscale thermometry. Here we show that the…
We establish a novel approach to probing spatially resolved multi-time correlation functions of interacting many-body systems, with scalable experimental overhead. Specifically, designing nonlinear measurement protocols for multidimensional…
An extremely sensitive temperature measurement MEMS device is developed based on the principle of structural deflection in a bi-material cantilever caused by a difference in thermal expansion coefficients. A dual-beam asymmetrical geometry…
This study presents a finite element and virtual element (FE-VE) coupled method for thermomechanical analysis in electronic packaging structures. The approach partitions computational domains strategically, employing FEM for regular…
In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effec-tive dissipation of heat. This can be achieved by the optimization of the system design…
Accurate knowledge of temperatures in power semiconductor modules is crucial for proper thermal management of such devices. Precise prediction of temperatures allows to operate the system at the physical limit of the device avoiding…
We will describe the thermal performance of power semiconductor module, which consists of hetero-junction bipolar transistors (HBTs), for mobile communication systems. We calculate the thermal resistance between the HBT fingers and the…
The response of electric devices to an applied thermal gradient has, so far, been studied almost exclusively in two-terminal devices. Here we present measurements of the response to a thermal bias of a four-terminal, quasi-ballistic…
Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available for both bulk…
Thermal measurements of heat capacity and thermal conductivity in a wide range of insulators and superconductors exhibit a ``thermal paradox": a large linear specific heat reminiscent of neutral Fermi surfaces in samples that exhibit no…
In this laboratory-based study, a plate was designed, manufactured and then characterised thermally and dimensionally using a thermal imager. This plate comprised a range of known scratch, dent, thinning and pitting artefacts as mimics of…
Side channels remain a challenge to information flow control and security in modern computing platforms. Resource partitioning techniques that minimise the number of shared resources among processes are often used to address this challenge.…
Energy requirements for heating and cooling of buildings constitute a major fraction of end use energy consumed. Therefore, it is important to provide the occupant comfort requirements in buildings in an energy efficient manner. However,…
Entanglement, and, in particular the entanglement spectrum, plays a major role in characterizing many-body quantum systems. While there has been a surge of theoretical works on the subject, no experimental measurement has been performed to…
Motivated by the dynamics of micro-scale oscillators with thermo-optical feedback, a simplified third order model, capturing the key features of these oscillators is developed, where each oscillator consists of a displacement variable…
Phase change materials (PCMs) hold considerable promise for thermal energy storage applications. However, designing a PCM system to meet specific performance presents a formidable challenge, given the intricate influence of multiple factors…
This review presents an overview of the thermal properties of mesoscopic structures. The discussion is based on the concept of electron energy distribution, and, in particular, on controlling and probing it. The temperature of an electron…
The steady state heat currents of continuous absorption machines can be decomposed into thermodynamically consistent contributions, each of them associated with a circuit in the graph representing the master equation of the thermal device.…
This paper presents dynamic thermal analyses of a power amplifier. All the investigations are based on the transient junction temperature measurements performed during the circuit cooling process. The presented results include the cooling…