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The melting of a binary system of charged particles confined in a {\it quasi}-one-dimensional parabolic channel is studied through Monte Carlo simulations. At zero temperature the particles are ordered in parallel chains. The melting is…
An imaging system for measuring the track structure of charged particles in a low-pressure gas is presented. We describe the experimental method and compare experimental results with first results of a simulation of the chamber response.
We investigate the emergence of a myriad of phases in the strong coupling regime of the dipolar Hubbard model in two dimensions. By using a combination of numerically unbiased methods in finite systems with analytical perturbative…
Multi-Processor Systems-on-Chip (MPSoC) can deliver high performance needed in many industrial domains, including aerospace. However, their high power consumption, combined with avionics safety standards, brings new thermal management…
Among all the properties required for the design of the next generation of PCM (density, heat capacity, thermal expansion, latent energy, volume change upon melting, corrosion rate, etc.) the thermal transport properties are by far the…
This study experimentally investigates the temperature distribution and behavior of a 48V Lithium-Ion (Li-ion) battery pack during two charge-discharge cycles using 25 thermocouples. Results indicate that better convective heat transfer…
We present a new technique of VLSI chip-level thermal analysis. We extend a newly developed method of solving two dimensional Laplace equations to thermal analysis of four adjacent materials on a mother board. We implement our technique in…
Future complementary metal oxide semiconductor (CMOS) scaling for advanced integrated circuit (IC) technologies may well depend on "More than Moore" (MtM) approaches using heterogeneous integration of semiconductor-based devices. In order…
Application of transition metal dichalcogenides (TMDC) in photonic, optoelectronic or valleytronic devices requires the growth of continuous monolayers, heterostructures and alloys of different materials in a single process. We present a…
This work presents a whole-year simulation study on nonlinear mixed-integer Model Predictive Control (MPC) for a complex thermal energy supply system which consists of a heat pump, stratified water storages, free cooling facilities, and a…
3D stacked technology has emerged as an effective mechanism to overcome physical limits and communication delays found in 2D integration. However, 3D technology also presents several drawbacks that prevent its smooth application. Two of the…
The thermal conductivity of nanometric objects or nanostructured materials can be determined using non equilibrium molecular dynamics (NEMD) simulations. The technique is simple in its principle, and resembles a numerical guarded hot plate…
Semiconductor integrated circuits operated at cryogenic temperature will play an essential role in quantum computing architectures. These can offer equivalent or superior performance to their room-temperature counterparts while enabling a…
Understanding the many-body dynamics of isolated quantum systems is one of the central challenges in modern physics. To this end, the direct experimental realization of strongly correlated quantum systems allows one to gain insights into…
Leveraging strong optoelectronic responses to external stimuli, such as temperature and electric fields, is central to the development of advanced photonic technologies, including adaptive photodetectors and reconfigurable photovoltaic…
These Lecture Notes discuss the recent theoretical advances in the understanding of open quantum many-body physics in platforms where both dissipative and coherent processes can be tuned and controlled to a high degree. We start by…
In this paper, electrothermal field phenomena in electronic components are considered. This coupling is tackled by multiphysical field simulations using the Finite Integration Technique (FIT). In particular, the design of bonding wires with…
Power consumption and heat dissipation become key elements in the field of high-end integrated circuits, especially those used in mobile and high-speed applications, due to their increase of transistor count and clock frequencies. Dynamic…
In this paper we present an algorithm for the coupling of magneto-thermal and mechanical finite element models representing superconducting accelerator magnets. The mechanical models are used during the design of the mechanical structure as…
This letter reports on the observation of optoelectronic switching in addressable molecular crossbar junctions fabricated using polymer stamp-printing method. The active medium in the junction is a molecular self-assembled monolayer softly…