Related papers: Thermal measurement and modeling of multi-die pack…
Multi-component self-assembly mixtures offer the possibility of encoding multiple target structures with the same set of interacting components. Selective retrieval of one of the stored structures has been attempted by preparing an initial…
Resistive RAM (RRAM) devices are candidates for neuromorphic computing devices in which the functionality lies in the formation and reversible rupture and gap-closing of conducting filaments in insulating layers. To explore the thermal…
We demonstrate millikelvin thermometry of laser cooled trapped ions with high-resolution imaging. This equilibrium approach is independent of the cooling dynamics and has lower systematic error than Doppler thermometry, with \pm5 mK…
This paper presents a study of accuracy issues in thermal modeling of high power LED modules on system level. Both physical as well as numerical accuracy issues are addressed. Incorrect physical assumptions may result in seemingly correct,…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
This paper proposes a novel multifunctional sensing platform based on multimode planar photonic crystals (PPCs). We analytically and numerically demonstrate that the reflection spectrum of PPCs exhibits multiple high-Q resonant modes, and…
The present paper numerically analyzes a passive cooling system using enclosures with different geometries filled with thermal conductivity-enhanced phase change material (PCM). A numerical code is developed using an unstructured…
Modern multiprocessor system-on-chips (SoCs) integrate multiple heterogeneous cores to achieve high energy efficiency. The power consumption of each core contributes to an increase in the temperature across the chip floorplan. In turn,…
The race towards performance increase and computing power has led to chips with heterogeneous and complex designs, integrating an ever-growing number of cores on the same monolithic chip or chiplet silicon die. Higher integration density,…
This study proposes a high-order multi-scale method tailored for time-dependent nonlinear thermo-electro-mechanical coupling problems of composite structures with highly spatial heterogeneity, which incorporate temperature-dependent…
Precise temperature measurement at micro/nanoscale is crucial across various domains including physical sciences, chemical processes, industrial production, medical diagnosis, weather forecasting, electronics, and biology. Micro/nanoscale…
Adhesive attachment systems consisting of multiple tapes or strands are commonly found in nature, for example in spider web anchorages or in mussel byssal threads, and their structure has been found to be ingeniously architected in order to…
This paper presents a novel method to estimate the power consumption of distinct active components on an electronic carrier board by using thermal imaging. The components and the board can be made of heterogeneous material such as plastic,…
A densely packed granular system is an example of an out-of-equilibrium system in the jammed state. It has been a longstanding problem to determine whether this class of systems can be described by concepts arising from equilibrium…
In this paper, we report on a multicore fiber-based (MCF) temperature sensor that operates in a wide thermal range and that is robustly packaged to withstand harsh environments. To develop the sensor, the fundamentals concerning the effect…
Estimation of thermal contact resistances between cylinders can be achieved using heating on the cross sections by a laser spot and measurement of the temperature response by IR thermography. This type of measurement makes it possible to…
Advances in instrumentation and tracer materials are still required to enable sensitive and accurate 3D temperature monitoring by magnetic particle imaging. We have developed a magnetic particle imaging instrument to observe temperature…
Thermal qualification of the die attach of semiconductor devices is a very important element in the device characterization as the temperature of the chip is strongly affected by the quality of the die attach. Voids or delaminations in this…
This paper analyzes a transient method for the characterization of low-resistance thermal interfaces of microelectronic packages. The transient method can yield additional information about the package not available with traditional static…
This work addresses the modelling, power control, and optimization of a thermal energy storage (TES) system combined with a vapour-compression refrigeration facility based on phase change materials (PCM). Given a novel design of a PCM-based…