We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these devices can be scaled easily in size and volume, making it a compelling candidate for future large-scale applications. A first series of prototypes that embed the ALPIDE chip has been produced, functionally tested, and shown to be working.
@article{arxiv.2205.12669,
title = {The MAPS foil},
author = {S. Beolé and F. Carnesecchi and G. Contin and R. de Oliveira and A. di Mauro and S. Ferry and H. Hillemanns and A. Junique and A. Kluge and L. Lautner and M. Mager and B. Mehl and K. Rebane and F. Reidt and I. Sanna and M. Šuljić and A. Yüncü},
journal= {arXiv preprint arXiv:2205.12669},
year = {2022}
}