Two-dimensional (2D) layered materials-based field-effect transistors (FETs) are promising for ultimate scaled electron device applications because of the improved electrostatics to atomically thin body thickness. However, compared with the typical thickness of ~5-nm for Si-on-insulator (SOI), the advantage of the ultimate thickness limit of monolayer for the device performance has not been fully proved yet, especially for the on-state at the accumulation region. Here, we present much stronger quantum-mechanical effect at the accumulation region based on the C-V analysis for top-gate MoS2 FETs. The self-consistent calculation elucidated that the electrons are confined in the monolayer thickness, unlike in the triangle potential formed by the electric field for SOI, the gate-channel capacitance is ideally maximized to the gate insulator capacitance since the capacitive contribution of the channel can be neglected due to the negligible channel thickness. This quantum-mechanical effect agreed well with the experimental results. Therefore, monolayer 2D channels are suggested to be used to enhance the on-current as well as the gate modulation ability.