Microelectromechanical systems (MEMS) technologies are developing rapidly with increasing study of the design, fabrication and commercialization of microscale systems and devices. Accurate mechanical properties are important for successful design and development of MEMS. We have demonstrated here a novel electroplating spring frame MEMS Structure Specimen integrates pin-pin align holes, misalignment compensate spring structure frame, load sensor beam and freestanding thin film. The specimen can be fit into a specially designed microtensile apparatus which is capable of carrying out a series of tests on sub-micro scale freestanding thin films.
@article{arxiv.0711.3300,
title = {Design and Development of Novel Electroplating Spring Frame Mems Structure Specimens for the Microtensile Testing of Thin Film Materials},
author = {Ming-Tzer Lin and Chi-Jia Tong and Chung-Hsun Chiang},
journal= {arXiv preprint arXiv:0711.3300},
year = {2007}
}
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