In this letter, we demonstrate high-performance lateral AlGaN/GaN Schottky barrier diodes (SBD) on Si substrate with a recessed-anode structure. The optimized rapid etch process provides results in improving etching quality with a 0.26-nm roughness of the anode recessed surface. By using the high work function metal Pt as the Schottky electrode, a low Von of 0.71 V is obtained with a high uniformity of 0.023 V for 40 devices. Supported by the flat anode recess surface and related field plate design, the SBD device with the anode-cathode spacing of 15 um show the Ron,sp of 1.53 mOhm.cm2 only, the breakdown voltage can reach 1592 V with a high power FOM (Figure-of-Merit) of 1656 MW/cm2. For the SBD device with the anode-cathode spacing of 30 um, the breakdown voltage can be as high as 2521 V and the power FOM is 1244 MW/cm2.
@article{arxiv.2007.03163,
title = {2.5-kV AlGaN/GaN Schottky Barrier Diode on Silicon Substrate with Recessed-anode Structure},
author = {Ru Xu and Peng Chen and Menghan Liu and Jing Zhou and Yunfei Yang and Yimeng Li and Cheng Ge and Haocheng Peng and Bin Liu and Zili Xie and Rong Zhang and Youdou Zheng},
journal= {arXiv preprint arXiv:2007.03163},
year = {2021}
}
Comments
5 pages, 9 figures. This work has ever been successfully submitted to the IEEE Electron Device Letters for possible publication in Sep. 2019, and the manuscript ID is EDL-2019-09-2015. Finally, it is suggested to be submitted to another journal such as IEEE JEDS