相关论文: Leveraging 3D Technologies for Hardware Security: …
The transistors used to construct Integrated Circuits (ICs) continue to shrink. While this shrinkage improves performance and density, it also reduces trust: the price to build leading-edge fabrication facilities has skyrocketed, forcing…
The emerging new paradigm of technologies, the internet of things, entails a process of device miniaturization to combine several functional components, such as sensors, actuators, and powering elements, in a single individual on-chip…
Not long ago, it was thought that only software applications and general purpose digital systems i.e. computers were prone to various types of attacks against their security. The underlying hardware, hardware implementations of these…
The emergence of chiplet-based heterogeneous integration is transforming the semiconductor, AI, and high-performance computing industries by enabling modular designs and improved scalability. However, assembling chiplets from multiple…
2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low-latency and high-throughput inter-chiplet interconnect…
Hyperdimensional Computing (HDC) is facing infringement issues due to straightforward computations. This work, for the first time, raises a critical vulnerability of HDC, an attacker can reverse engineer the entire model, only requiring the…
The majority of microfabricated ion traps in use for quantum information processing are of the 2D 'surface-electrode' type or of the 3D 'wafer' type. Surface-electrode traps greatly simplify fabrication and hold the promise of allowing…
Ion traps are used for a wide range of applications from metrology to quantum simulations and quantum information processing. Microfabricated chip-based 3D ion traps are scalable to store many ions for the realization of a large number of…
The impact of designing for security of AI is critical for humanity in the AI era. With humans increasingly becoming dependent upon AI, there is a need for neural networks that work reliably, inspite of Adversarial attacks. The vision for…
Enhancement of the number and array density of nozzles within an inkjet head chip is one of the keys to raise the printing speed and printing resolutions. However, traditional 2D architecture of driving circuits can not meet the requirement…
Data collection and processing in advanced health monitoring systems are experiencing revolutionary change. In-Sensor Computing (ISC) systems emerge as a promising alternative to save energy on massive data transmission, analog-to-digital…
The increasing density of transistors in Integrated Circuits (ICs) has enabled the development of highly integrated Systems-on-Chip (SoCs) and, more recently, Multiprocessor Systems-on-Chip (MPSoCs). To address scalability challenges in…
DRAM-based main memory and its associated components increasingly account for a significant portion of application performance bottlenecks and power budget demands inside the computing ecosystem. To alleviate the problems of storage density…
Over the last decade, artificial intelligence has found many applications areas in the society. As AI solutions have become more sophistication and the use cases grew, they highlighted the need to address performance and energy efficiency…
The many cores design research community have shown high interest in optical crossbars on chip for more than a decade. Key properties of optical crossbars, namely a) contention free data routing b) low latency communication and c) potential…
The globalization of semiconductor supply chains has exposed Network-on-Chip (NoC) interconnects in System-on-Chip (SoC) architectures to critical security risks, including reverse engineering and IP theft. To address these threats, this…
Hybrid analog-digital precoding significantly reduces the hardware costs in massive MIMO transceivers when compared to fully-digital precoding at the expense of increased transmit power. In order to mitigate the above shortfall, we use the…
Logic locking has emerged as a promising solution for protecting the semiconductor intellectual Property (IP) from the untrusted entities in the design and fabrication process. Logic locking hides the functionality of the IP by embedding…
In this paper, we assess the security and testability of the state-of-the-art design-for-security (DFS) architectures in the presence of scan-chain locking/obfuscation, a group of solution that has previously proposed to restrict…
The continued adoption of Additive Manufacturing technologies is raising concerns in the security, forensics, and intelligence gathering communities. These concerns range from identifying and mitigating compromised devices, to theft of…