相关论文: Transient heat flux shielding using thermal metama…
With the increasing complexity of the electromagnetic environment, electromagnetic interference has already been an important problem for optoelectronic systems to be reckoned with. The metal mesh film is a kind of widely used…
The thermal conductivity of Functionally Graded Materials (FGMs) can be efficiently designed through topology optimization to obtain thermal meta-structures that actively steer the heat flow. Compared to conventional analytical design…
We explore layered strongly correlated materials as a platform to identify and control unconventional heat transfer phenomena. We demonstrate that these systems can be tailored to sustain a wide spectrum of heat transport regimes, ranging…
Graphene was recently proposed as a material for heat removal owing to its extremely high thermal conductivity. We simulated heat propagation in silicon-on-insulator circuits with and without graphene lateral heat spreaders. Numerical…
A simple idea of finding a domain that encloses an unknown discontinuity embedded in a body is introduced by considering an inverse boundary value problem for the heat equation. The idea gives a design of a special heat flux on the surface…
This paper first reviews non-traditional heat exchanger geometry, laser welding, practical issues with microchannel heat exchangers, and high effectiveness heat exchangers. Existing microchannel heat exchangers have low material costs, but…
We present a novel antireflection approach utilizing planar metamaterials on dielectric surfaces. It consists of a split-ring resonator array and a metal mesh separated by a thin dielectric spacer. The coating dramatically reduces the…
In this Letter we present resonance properties in terahertz metamaterials consisting of a split-ring resonator array made from high temperature superconducting films. By varying the temperature, we observed efficient metamaterial resonance…
Topological materials provide a platform that utilizes the geometric characteristics of structured materials to control the flow of waves, enabling unidirectional and protected transmission that is immune to defects or impurities. The…
Heat flux sensors have potential in enabling applications that require tracking of direct and instantaneous thermal energy transfer. To facilitate their use, the sensors have to be robust and feasible to implement, while maintaining high…
The flexible profile approach proposed earlier to create CTM (compact or reduced order thermal models) is extended to cover the area of conjugate heat transfer. The flexible profile approach is a methodology that allows building a highly…
Thermal energy storage using sensible heating of a solid storage medium is a potential low-cost technology for long-duration energy storage. To effectively get heat in and out of the solid material, channels of heat transfer fluid can be…
Thermal nonreciprocity plays a vital role in chip heat dissipation, energy-saving design, and high-temperature hyperthermia, typically realized through the use of advanced metamaterials with nonlinear, advective, spatiotemporal, or gradient…
Heat transfer in semiconductor devices is dominated by chip and substrate assemblies, where heat generated within a finite chip layer dissipates into a semi-infinite substrate with much higher thermophysical properties. This mismatch…
Metamaterials, which are materials engineered to possess novel optical properties, have been increasingly studied. The ability to fabricate metamaterials has sparked an interest in determining possible applications. We investigate using a…
The concept of cloaking -- hiding objects from external detection -- has seen wide success in linear systems. Yet, translating these advancements to nonlinear mechanical systems remains an open challenge. Here, we present a new approach to…
Heterostructures consisting of alternating GaN/AlN epitaxial layers represent the building-blocks of state-of-the-art devices employed for active cooling and energy-saving lightning. Insights into the heat conduction of these structures are…
An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly…
Frequently, the design of physicochemical processes requires screening of large numbers of alternative designs with complex geometries. These geometries may result in conformal meshes which introduce stability issues, significant…
Simultaneously manipulating multiple physical fields plays an important role in the increasingly complex integrated systems, aerospace equipment, biochemical productions, etc. For on-chip systems with high integration level (e.g.,…