基于 VHDL-AMS 的高级紧凑热建模
材料科学
2007-09-13 v1
摘要
本文提出了一种利用 VHDL-AMS 建模语言生成紧凑热模型（CTM）的改进方法。该方法能够为多芯片组件和系统生成边界条件独立（BCI）的 CTM，同时考虑半导体及其他材料的非线性热导率。
引用
@article{arxiv.0709.1830,
title = {Advanced Compact Thermal Modeling by using VHDL-AMS},
author = {W. Habra and P. Tounsi and J. -M. Dorkel},
journal= {arXiv preprint arXiv:0709.1830},
year = {2007}
}
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