Multichip modules (MCM) with 4 single photon counting MPEC 2.3 chips bump bonded to 1.3 cm x 1.3 cm large CdTe and Si semiconductor sensors as well as to single chip pixel detectors have been successfully built and operated. The MPEC 2.3 chip provides a pixel count rate up to 1 MHz with a large dynamic range of 18 bit, 2 counters and energy windowing with continuously adjustable thresholds. Each MPEC has 32 x 32 pixels of 200 um x 200 um pixel size. For a MCM the 4 chips are arranged in a 2 x 2 array which leads to a 64 x 64 sensor pixel geometry. The MCM construction is described, and the imaging performance of the different detectors is shown. As readout system a newly developed USB system has been used.
@article{arxiv.physics/0312070,
title = {Single Photon Counting X-ray Imaging with Si and CdTe Single Chip Pixel Detectors and Multichip Pixel Modules},
author = {Peter Fischer and Sven Krimmel and Hans Krueger and Markus Lindner and Mario Loecker and Kazuhiro Nakazawa and Tadayuki Takahashi and Norbert Wermes},
journal= {arXiv preprint arXiv:physics/0312070},
year = {2015}
}