Related papers: The H1 Silicon Vertex Detector
The Analog Pipeline Chip (APC) is a low noise, low power readout chip for silicon micro strip detectors with 128 channels containing an analog pipeline of 32 buffers depth. The chip has been designed for operation at HERA with a power…
The silicon systems of the Large Hadron Collider (LHC) detectors are briefly described. The complexity and diversity of the projects are illustrated by highlighting for discussion different components of the silicon systems in each…
In order to extend the tracking acceptance, to improve the primary and secondary vertex reconstruction and thus enhancing the tagging capabilities for short lived particles, the ZEUS experiment at the HERA Collider at DESY installed a…
Hydrogenated amorphous silicon (a-Si:H) has remarkable radiation resistance properties and can be deposited on a lot of different substrates. A-Si:H based particle detectors have been built since mid 1980s as planar p-i-n or Schottky diode…
CLIC is a proposed linear $e^+e^-$ collider with center-of-mass energies of up to 3 TeV. Its main objectives are precise top quark, Higgs boson and Beyond Standard Model physics. In addition to spatial resolutions of a few micrometers and a…
The Silicon Vertex Detector of Belle II is a state-of-the-art tracking and vertexing system based on double-sided silicon strip sensors, designed and fabricated by a large international collaboration in the period 2012--2018. Since 2019 it…
In order to fully exploit the Physics potential of future e+ e- linear collider, a Vertex Detector providing high resolution track reconstruction is required. Hybrid Silicon pixel detectors are an attractive option for the sensor technology…
3D silicon detectors are characterized by cylindrical electrodes perpendicular to the surface and penetrating into the bulk material in contrast to standard Si detectors with planar electrodes on its top and bottom. This geometry renders…
The CMS pixel detector consists of approximately 66 million silicon pixels whose analog signals are read out by 15,840 programmable Readout Chips. With the recent startup of the LHC, the detector is now collecting data used for precise…
Pixel vertex detectors are THE instrument of choice for the tracking of charged particles close to the interaction point at the LHC. Hybrid pixel detectors, in which sensor and read-out IC are separate entities, constitute the present state…
A set of analog electronics boards for serial readout of silicon strip sensors was fabricated. A commercially available amplifier is mounted on a homemade hybrid board in order to receive analog signals from silicon strip sensors. Also,…
Various chips for the silicon sensors measurements are described. These chips are based on 0.35 um and 0.18um CMOS technology. Several analog chips together with self-trigger /derandomizer one allow to measure silicon sensors designed for…
The LHCb detector has undergone a major upgrade for LHC Run 3. This Upgrade I detector facilitates operation at higher luminosity and utilises full-detector information at the LHC collision rate, critically including the use of vertex…
A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to…
The ATLAS pixel detector consists of 1744 identical silicon pixel modules arranged in three barrel layers providing coverage for the central region, and three disk layers on either side of the primary interaction point providing coverage of…
The Circular Electron Positron Collider (CEPC) has been proposed to enable more thorough and precise measurements of the properties of Higgs, W, and Z bosons, as well as to search for new physics. In response to the stringent performance…
CLIC is a proposed linear e+e- collider designed to provide particle collisions at center-of-mass energies of up to 3 TeV. Precise measurements of the properties of the top quark and the Higgs boson, as well as searches for Beyond the…
This paper describes the integration structures for the silicon strips tracker of the ATLAS detector proposed for the Phase-II upgrade of the Large Hadron Collider (LHC), also referred to as High Luminosity LHC (HL-LHC). In this proposed…
Active Pixel Sensor (APS) technology has shown promise for next-generation vertex detectors. This paper discusses the design and testing of two generations of APS chips. Both are arrays of 128 by 128 pixels, each 20 by 20 micro-m. Each…
The explosion of data volume in communications, AI training, and cloud computing requires efficient data handling, which is typically stored as digital electrical information and transmitted as wireless radio frequency (RF) signals or light…