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We are evaluating the performance of a Passive Gamma Emission Tomography (PGET) device equipped with 3D position-sensitive cadmium zinc telluride (CZT) gamma-ray detectors when used for inspecting spent nuclear fuel assemblies (SFAs).…
We report on hydrazine-sensing organic electrochemical transistors (OECTs) with a design consisting in concentric annular electrodes. The design engineering of these OECTs was motivated by the great potential of using OECT sensing arrays in…
Silicon photonics has many attractive features but faces a major issue: inefficient and slow photodetection in the telecom range. New metal-semiconductor Schottky photodetectors based on intraband absorption address this problem, but their…
Polarizers and polarization selective resonant cavities (e.g., ring resonators, gratings), are key components for applications to photography, coherent optical detection, polarization-division-multiplexing, optical sensing and liquid…
Two-dimensional (2D) diffraction gratings offer a polarization-independent coupling solution between the planar photonic chips and optical fibers, with advantages including placement flexibility, ease of fabrication, and tolerance to…
A device has been built and tested, in which a ceramic superconducting cathode and a copper anode cause electrical discharges in low pressure gases, at temperatures between 50 and 70 K. The electrodes are connected to a capacitors array…
Striating HTS coated conductor (CC) tapes into narrow filaments offers the possibility of reducing the tapes' magnetization losses without unreasonably decreasing their current-carrying capability. However, realizing well-separated…
We report on thin-film processing improvements in the fabrication of superconducting quasiparticle-trap-assisted electrothermal-feedback transition-edge sensors (QETs) used in the design of Cryogenic Dark Matter Search (CDMS) detectors. The…
The radiation hardness of passive CMOS pixel sensors fabricated in 150 nm LFoundry technology is investigated. CMOS process lines are especially of interest for large-scale silicon detectors as they offer high production throughput at…
Silicon is a promising anode material for next-generation lithium-ion batteries due to its exceptionally high specific capacity (3600 mAh g$^{-1}$), significantly exceeding that of conventional graphite. However, its practical application…
This study proposes a novel design of glucose sensor with enhanced selectivity and sensitivity by using graphene Schottky diodes, which is composed of Graphene (G)/Platinum Oxide (PtO)/n-Silicon (Si) heterostructure. The sensor was tested…
We study the effect of a surface modification at the interface between metallic electrodes and semiconducting substrate in Semi-Insulating GaAs (SI-GaAs) based photoconductive emitters (PCE) on the emission of Tera-Hertz (THz) radiation. We…
We present a comprehensive characterization of resistive PICOSEC Micromegas detector prototypes, tested under identical conditions, constant drift gap, field configurations, and photocathode at the CERN SPS H4 beam line. This work provides…
Organ-specific, targeted Field-of-View (FoV) Positron Emission Tomography (PET)/Magnetic Resonance Imaging (MRI) inserts are viable solutions for a number of imaging tasks where whole-body PET/MRI systems lack the necessary sensitivity and…
We demonstrate enhanced light extraction for monochrome top-emitting organic light-emitting diodes (OLEDs). The enhancement by a factor of 1.2 compared to a reference sample is caused by the use of a hole transport layer (HTL) material…
The charge collection properties in different particle sensor materials with respect to the shape of the generated signals, the electric field within the detector, the charge carrier mobility and the carrier lifetime are studied with the…
Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after…
The ATLAS Forward Physics (AFP) project plans to install 3D silicon pixel detectors about 210 m away from the interaction point and very close to the beamline (2-3 mm). This implies the need of slim edges of about 100-200 $\mu$m width for…
A novel gaseous two-dimensional imaging detector "Micro Pixel Chamber (micro-PIC)" has been developed. This detector is based on double sided printed circuit board (PCB). We have developed large area (10cm x 10cm) micro-PICs with 65536…
We are investigating the use of low temperature wafer-wafer bonding in the fabrication of next-generation particle pixel detectors. This bonding technique could enable the integration of fully processed CMOS readout wafers with high-Z…