Related papers: CLIPGen: A Chiplet Link IP Modeling and Generation…
The chiplet-based System-in-Package~(SiP) technology enables more design flexibility via various inter-chiplet connection and heterogeneous integration. However, it is not known how to convert such flexibility into cost efficiency, which is…
Chiplet architectures are on the rise as they promise to overcome the scaling challenges of monolithic chips. A key component of such architectures is an efficient inter-chiplet interconnect (ICI). The ICI design space is huge as there are…
Multi-chiplet architectures enabled by glass interposer offer superior electrical performance, enable higher bus widths due to reduced crosstalk, and have lower capacitance in the redistribution layer than current silicon interposer-based…
Enhancing performance while reducing costs is the fundamental design philosophy of integrated circuits (ICs). With advancements in packaging technology, interposer-based chiplet architecture has emerged as a promising solution. Chiplet…
Heterogeneous chiplets have been proposed for accelerating high-performance computing tasks. Integrated inside one package, CPU and GPU chiplets can share a common interconnection network that can be implemented through the interposer.…
Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and…
A chiplet is an integrated circuit that encompasses a well-defined subset of an overall system's functionality. In contrast to traditional monolithic system-on-chips (SoCs), chiplet-based architecture can reduce costs and increase…
2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects (ICIs). As the number of chiplets…
Recently, hardware technology has rapidly evolved pertaining to domain-specific applications/architectures. Soon, processors may be composed of a large collection of vendor-independent IP specialized for application-specific algorithms,…
The main design principles in computer architecture have recently shifted from a monolithic scaling-driven approach to the development of heterogeneous architectures that tightly co-integrate multiple specialized processor and memory…
Trapped ions are among the most promising platforms for realizing a large-scale quantum information processor. Current progress focuses on integrating optical and electronic components into microfabricated ion traps to allow scaling to…
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…
The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-scale VLSI systems with higher energy efficiency in data…
The exponential growth of AI has created unprecedented demand for computational resources, pushing chip designs to the limit while simultaneously escalating the environmental footprint of computing. As the industry transitions toward…
The emergence of chiplet-based heterogeneous integration is transforming the semiconductor, AI, and high-performance computing industries by enabling modular designs and improved scalability. However, assembling chiplets from multiple…
2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low-latency and high-throughput inter-chiplet interconnect…
Large language models (LLMs) such as OpenAI's ChatGPT and Google's Gemini have demonstrated unprecedented capabilities of autoregressive AI models across multiple tasks triggering disruptive technology innovations around the world. However,…
With the increasing prevalence of chiplet systems in high-performance computing applications, the number of design options has increased dramatically. Instead of chips defaulting to a single die design, now there are options for 2.5D and 3D…
Modern Artificial Intelligence (AI) workloads demand computing systems with large silicon area to sustain throughput and competitive performance. However, prohibitive manufacturing costs and yield limitations at advanced tech nodes and…
In large-scale distributed LLM training, communication between devices becomes the key performance bottleneck. Chiplet technology can integrate multiple dies into a package to scale-up node performance with higher bandwidth. Meanwhile,…